H05K 2201/10393
Clamping a component by an element or a set of elements
H05K2201/10393 (Clamping a component by an element or a set of elements) appears on 293 US grants and 253 published applications in this corpus.
Search patents in H05K- Granted patents
- 293
- Published applications
- 253
- Assignees
- 216
- Inventors
- 733
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 7 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 1 |
| 2003 | 5 | 3 |
| 2004 | 4 | 3 |
| 2005 | 5 | 6 |
| 2006 | 3 | 12 |
| 2007 | 13 | 6 |
| 2008 | 3 | 12 |
| 2009 | 5 | 8 |
| 2010 | 5 | 11 |
| 2011 | 9 | 14 |
| 2012 | 4 | 3 |
| 2013 | 9 | 8 |
| 2014 | 6 | 10 |
| 2015 | 6 | 8 |
| 2016 | 8 | 5 |
| 2017 | 12 | 9 |
| 2018 | 5 | 10 |
| 2019 | 16 | 21 |
| 2020 | 28 | 24 |
| 2021 | 22 | 14 |
| 2022 | 10 | 18 |
| 2023 | 11 | 14 |
| 2024 | 13 | 12 |
| 2025 | 8 | 6 |
| 2026 | 7 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including printed circuit board30 Jun 2026US 12,669,849 B2Samsung Electronics Co., Ltd.
- Printed circuit board with an edge stiffener structure16 Jun 2026US 12,660,091 B2Intel Corporation
- Power device9 Jun 2026US 12,651,964 B2Delta Electronics (Shanghai) Co., Ltd.
- Method and structure for alignment of lens to optical product at PCBA level9 Jun 2026US 12,652,754 B2Pixart Imaging Inc.
- Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking9 Jun 2026US 12,653,029 B2United Silicon Carbide, Inc.
- Toolless locking member and electronic system comprising the same8 Oct 2026US 2026/0313806 A1Amphenol Commercial Products (ChengDu) Co.LTD
- Phase shifter assembly1 Oct 2026US 2026/0304625 A1Suzhou Luxshare Technology Co., Ltd.
- Component covers inhibiting dynamic component warping during reflow10 Sep 2026US 2026/0271194 A1International Business Machines Corporation
- High-voltage printed circuit board with integrated plasma discharge electrodes for scalable plasma-based water treatment systems13 Aug 2026US 2026/0239528 A1Black Spark Inc
- Multicomponent Connector6 Aug 2026US 2026/0231333 A1KYOCERA AVX Components Corporation
Most cited
By later US patents
- LED mounting system117US 6,582,100 B1Relume Corporation · 2003
- Pluggable chip scale package116US 6,078,500 AInternational Business Machines Corporation · 2000
- Spring biased tapered contact elements for electrical connectors and integrated circuit packages103US 5,366,380 AGeneral DataComm, Inc. · 1994
- Electrical assembly96US 4,563,725 AWelwyn Electronics Limited · 1986
- Mechanical printed circuit board and ball grid array interconnect apparatus74US 5,400,220 ADell USA, L. P. · 1995