Pluggable chip scale package

A structure comprising:

• an electronic device having a first surface and an opposite second surface, said first surface having a plurality of first electrical contact locations and said second surface having a heat sink attached thereto;
• a substrate having a surface having a plurality of substrate electrical contact locations;
• a flexible interposer comprising an elastomeric layer material and a plurality of elongated electrical conductors disposed therein and extending from its first side to its second side, each of said elongated electrical conductors having a first end at said first side of said flexible interposer and a second end at said second side of said interposer, said first ends of said plurality of said elongated electrical conductors being a ball bond attached to one of said plurality of substrate contact locations, and said second ends of said elongated electrical conductors including a plurality of ball shaped contacts;
• said elongated electrical conductors being substantially perpendicular to said electronic device and said interposer and being coated with a barrier metal;
• each of said plurality of elongated electrical conductors is a continuous unitary wire;
• said interposer is disposed between said electronic device and said substrate;
• means for pushing said electronic device towards said substrate so that said flexible interposer is disposed between said first surface of said electronic device and said surface of said substrate so that said first ends of said elongated electrical conductors at said first surface of said electronic device and so that said second ends of said elongated electrical conductors of said flexible interposer contact said substrate electrical contact locations;
• said heat sink attached to said second surface forming means for aligning said electronic device to said substrate so that said seconds ends of said elongated electrical conductors of said flexible interposer align to said first electrical contact locations on said electronic device and to said substrate contact locations respectively;
• said heat sink comprising:
• a clamping fixture which is formed from a single piece of spring sheet metal, said clamping fixture is located and attached to said substrate using a pair of substrate alignment pins and a pair of substrate lock features, said substrate alignment pins and substrate lock features are affixed to and in said substrate, said substrate alignment pins and the substrate lock features are formed with tapered ends to help guide the pins and locks into corresponding holes in said substrate, said clamping fixture provides means for pushing;
• said electronic device has a center and wherein said plurality of elongated electrical conductors have a geometry that is angled away from said center of said electronic device for fanning out said contact locations on said electronic device to a wider spaced array of substrate electrical contact locations.