H05K 2201/10371
Shields or metal cases
H05K2201/10371 (Shields or metal cases) appears on 812 US grants and 911 published applications in this corpus.
Search patents in H05K- Granted patents
- 812
- Published applications
- 911
- Assignees
- 373
- Inventors
- 2,086
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 4 |
| 2002 | 15 | 10 |
| 2003 | 6 | 13 |
| 2004 | 16 | 15 |
| 2005 | 15 | 23 |
| 2006 | 7 | 21 |
| 2007 | 14 | 17 |
| 2008 | 17 | 26 |
| 2009 | 15 | 37 |
| 2010 | 19 | 35 |
| 2011 | 19 | 23 |
| 2012 | 19 | 29 |
| 2013 | 27 | 34 |
| 2014 | 22 | 24 |
| 2015 | 25 | 26 |
| 2016 | 23 | 33 |
| 2017 | 36 | 61 |
| 2018 | 43 | 56 |
| 2019 | 62 | 68 |
| 2020 | 70 | 78 |
| 2021 | 51 | 83 |
| 2022 | 47 | 47 |
| 2023 | 61 | 52 |
| 2024 | 45 | 42 |
| 2025 | 54 | 34 |
| 2026 | 16 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Module including metal member with protruding portion and method for manufacturing module29 Sep 2026US 12,750,992 B2Murata Manufacturing Co., Ltd.
- Deep pluggable receptacle1 Sep 2026US 12,727,087 B1PicoJool, Inc.
- Reinforcement structure and electronic device18 Aug 2026US 12,713,927 B2Huawei Technologies Co., Ltd.
- Electronic device with improved shielding structure4 Aug 2026US 12,701,686 B2Sony Interactive Entertainment Inc.
- Method for manufacturing a printed circuit board with an embedded shield21 Jul 2026US 12,690,139 B2
- Radio-frequency/electromagnetic shielding for system-in-package10 Sep 2026US 2026/0271252 A1Meta Platforms Technologies, LLC
- Shield structure and electronic device6 Aug 2026US 2026/0231383 A1
- Heat dissipation structure for semiconductor package module and electronic device including the same23 Jul 2026US 2026/0215275 A1Unick Corporation
- Electronic device with electromagnetic shielding9 Jul 2026US 2026/0197933 A1Arcadyan Technology Corporation
- Circuit board assembly2 Jul 2026US 2026/0190225 A1Foxconn Interconnect Technology Limited
Most cited
By later US patents
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- Solar photovoltaic inverters128US 8,542,512 B2Enecsys Limited · 2013
- EMI/RFI shielding method and apparatus101US 5,014,160 ADigital Equipment Corporation · 1991
- Hybrid module and methods for manufacturing and mounting thereof97US 6,163,456 ATaiyo Yuden Co., Ltd. · 2000