Hybrid module and methods for manufacturing and mounting thereof
AssigneeTaiyo Yuden Co., Ltd.
InventorsKazutaka Suzuki, Naoto Narita, Tohru Watanabe, Yoshiaki Kamiyama, Kazuki Yagi
Life of this patent
Estimating the term…
Abstract
In a hybrid module which is mounted on a mother circuit board with a first surface of a substrate opposed to the mother circuit board, a cavity is formed on the first surface, and a heat-generating circuit component is facedown-bonded in the cavity. Heat generated in the circuit component is radiated to the mother circuit board through a heat radiation plate.
Claims35
A hybrid module comprising
- a substrate including a cavity on a first surface of said substrate,
- a heat-generating circuit component mounted on said substrate,
- said hybrid module being mounted on a mother circuit board with the first surface being opposed to said mother circuit board,
- said circuit component being facedown-bonded in said cavity,
- a layer of said substrate on which said circuit component is mounted having circuit patterns connected with terminal electrodes of said circuit component, and
- regions of said layer which are not occupied by said circuit patterns being covered with a ground conductor pattern insulated from said circuit patterns.
A hybrid module comprising
- a substrate including a cavity on a first surface of said substrate,
- a heat-generating circuit component mounted on said substrate,
- said hybrid module being mounted on a mother circuit board with the first surface being opposed to said mother circuit board,
- said circuit component being facedown-bonded in said cavity,
- said cavity on said substrate including a first cavity on said surface and a second cavity on the bottom surface of said first cavity,
- said circuit component being facedown-bonded in said second cavity, and
- a thermal-conductor element in said first cavity for transferring heat generated in said circuit component to said mother circuit board.
The hybrid module according to claim 4, wherein:
- said substrate is a multilayer substrate including a plurality of laminated sheets of a predetermined thickness.
A method of manufacturing a hybrid module including a substrate, a heat-generating circuit component mounted on said substrate, and a heat transfer plate for said circuit component, said method comprising:
- fabricating said substrate having a first cavity and a second cavity formed on the bottom of said first cavity,
- mounting said circuit component in said second cavity of said substrate,
- injecting a thermal-conductive resin into said first cavity, and
- fitting said heat transfer plate having an adjustment hole into said first cavity in which said thermal-conductive resin is injected.
A method of mounting a hybrid module onto a mother circuit board, said hybrid module including a substrate, a circuit component mounted on said substrate, a heat transfer plate for said circuit component, and a terminal electrode, said mounting method comprising:
- bonding said terminal electrode with a conductor pattern formed on said mother circuit board, and
- bonding said heat transfer plate with a thermal-conductive film formed on said mother circuit board.
A hybrid module for mounting on a mother circuit board, the hybrid module comprising a substrate including a cavity having a terraced structure on a first surface of said substrate, and a heat-generating circuit component mounted on said substrate, said hybrid module being arranged so that when it is mounted on the mother circuit board, the first surface is opposed to said mother circuit board, said circuit component being facedown-bonded in said cavity.
A hybrid module for mounting on a mother circuit board, the hybrid module comprising
- a substrate including a cavity on a first surface of said substrate,
- a heat-generating circuit component mounted on said substrate,
- said hybrid module being arranged so that when it is mounted on the mother circuit board, the first surface is opposed to said mother circuit board, said circuit component being facedown-bonded in said cavity,
- a layer of said substrate on which said circuit component is mounted having circuit patterns connected with terminal electrodes of said circuit component, and
- regions of said layer which are not occupied by said circuit patterns being covered with a ground conductor pattern insulated from said circuit patterns.
A hybrid module for mounting on a mother circuit board, the hybrid module comprising
- a substrate including a cavity on a first surface of said substrate,
- a heat-generating circuit component mounted on said substrate,
- said hybrid module being arranged so that when it is mounted on the mother circuit board, the first surface is opposed to said mother circuit board,
- said circuit component being facedown-bonded in said cavity,
- said cavity formed on said substrate including a first cavity on said surface and a second cavity on the bottom surface of said first cavity,
- said circuit component being facedown-bonded in said second cavity, and
- a thermal-conductor element in said first cavity for transferring heat generated in said circuit component to said mother circuit board.
A hybrid module for mounting on a mother circuit board, the hybrid module comprising
- a substrate including a cavity on a first surface of said substrate,
- a heat-generating circuit component mounted on said substrate,
- said hybrid module being arranged so that when it is mounted on the mother circuit board, the first surface is opposed to said mother circuit board,
- said circuit component being facedown-bonded in said cavity, and
- an external electrode formed on a side surface of the substrate.
A hybrid module for mounting on a mother circuit board, the hybrid module comprising a substrate including a cavity on a first surface of said substrate, and a heat-generating circuit component mounted on said substrate, said hybrid module being arranged so that when it is mounted on the mother circuit board, the first surface is opposed to said mother circuit board, said circuit component being facedown-bonded in said cavity, and a thermal-conductor element in the cavity.
Dependencies are inferred from the claim text.