H05K 2201/10325
Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or
Official title: Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
H05K2201/10325 (Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or) appears on 513 US grants and 501 published applications in this corpus.
Search patents in H05K- Granted patents
- 513
- Published applications
- 501
- Assignees
- 296
- Inventors
- 1,253
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 8 | 6 |
| 2002 | 14 | 21 |
| 2003 | 19 | 29 |
| 2004 | 17 | 16 |
| 2005 | 13 | 12 |
| 2006 | 10 | 21 |
| 2007 | 16 | 23 |
| 2008 | 15 | 20 |
| 2009 | 16 | 15 |
| 2010 | 17 | 26 |
| 2011 | 18 | 15 |
| 2012 | 15 | 14 |
| 2013 | 13 | 8 |
| 2014 | 9 | 22 |
| 2015 | 15 | 9 |
| 2016 | 15 | 18 |
| 2017 | 16 | 9 |
| 2018 | 14 | 24 |
| 2019 | 30 | 36 |
| 2020 | 31 | 25 |
| 2021 | 25 | 20 |
| 2022 | 14 | 18 |
| 2023 | 22 | 37 |
| 2024 | 15 | 19 |
| 2025 | 20 | 17 |
| 2026 | 11 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Deep pluggable receptacle1 Sep 2026US 12,727,087 B1PicoJool, Inc.
- Releasable spacer, solid-state drive assembly, and method to manufacture the same21 Jul 2026US 12,690,132 B2Solidigm Inc.
- Flexible printed circuit board with near-field communication (NFC) coil integration9 Jun 2026US 12,651,831 B2Meta Platforms Technologies, LLC
- Power converter, inter-component connection system, and inter-component connection method28 Apr 2026US 12,614,867 B2Panasonic Automotive Systems Co., Ltd.
- Electrical to optical converter module with dedicated high speed substrate21 Apr 2026US 12,607,816 B1
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Stacked board and computer device employing board27 Aug 2026US 2026/0255487 A1Hon Hai Precision Industry Co., Ltd.
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Electronic device13 Aug 2026US 2026/0240039 A1Advanced Semiconductor Engineering, Inc.
- 128 byte cache line memory controller for non-standard dimm architecture6 Aug 2026US 2026/0231332 A1Tachyum Ltd.
Most cited
By later US patents
- Inter-circuit encapsulated packaging132US 6,304,450 B1INCEP Technologies, Inc. · 2001
- Separable electrical interconnect with anisotropic conductive elastomer for translating footprint119US 7,249,954 B2Paricon Technologies Corporation · 2007
- Electrical connector with improved feature for securing solder ball thereon91US 8,052,454 B2Hon Hai Precision Ind.Co., Ltd. · 2011
- Multi-level assemblies for interconnecting integrated circuits88US 5,479,319 AInterconnect Systems, Inc. · 1995
- Multi-level assemblies and methods for interconnecting integrated circuits84US 5,481,436 AInterconnect Systems, Inc. · 1996