Electronic device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKuofeng HUANG, Chih Lung HUNG, Hsin-Hua HUANG, Chi Hao CHIANG, Hsin-Chin CHANG
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Abstract
The present disclosure provides an electronic device. The electronic device includes a first stage power module, a second stage power, a first circuit structure, and a connector. The second stage power module is at least partially vertically overlapping the first stage power module. The first circuit structure separates the first stage power module from the second stage power module. The connector is supported by the first circuit structure and configured to transmit an external power to the first stage power module.
Claims20
An electronic device, comprising:
- a first stage power module;
- a second stage power module at least partially vertically overlapping the first stage power module;
- a first circuit structure separating the first stage power module from the second stage power module;
- and
- a connector supported by the first circuit structure and configured to transmit an external power to the first stage power module.
An electronic device, comprising:
- a first stage power module;
- and
- a second stage power module comprising a first voltage regulator laterally overlapping the first stage power module and a second voltage regulator vertically overlapping the first stage power module,
- wherein the first stage power module is configured to provide the first voltage regulator with a first regulated power and to provide the second voltage regulator with a second regulated power substantially the same as the first regulated power.
An electronic device, comprising:
- a first stage power module;
- a second stage power module laterally overlapping the first stage power module and configured to receive a regulated power from the first stage power module, wherein a vertical dimension of the second stage power module is greater than a vertical dimension of the first stage power module;
- and
- a heat dissipating structure having a substantially uniform vertical dimension and configured to be thermally coupled to the first power stage module and the second stage power module.
Dependencies are inferred from the claim text.