H03H 9/059
Consisting of mounting pads or bumps
Official title: {consisting of mounting pads or bumps}
H03H9/059 (Consisting of mounting pads or bumps) appears on 479 US grants and 533 published applications in this corpus.
Search patents in H03H- Granted patents
- 479
- Published applications
- 533
- Assignees
- 107
- Inventors
- 706
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 6 |
| 2002 | 10 | 11 |
| 2003 | 10 | 17 |
| 2004 | 10 | 24 |
| 2005 | 13 | 27 |
| 2006 | 19 | 28 |
| 2007 | 23 | 15 |
| 2008 | 14 | 5 |
| 2009 | 14 | 9 |
| 2010 | 5 | 24 |
| 2011 | 14 | 12 |
| 2012 | 12 | 9 |
| 2013 | 13 | 15 |
| 2014 | 13 | 19 |
| 2015 | 13 | 11 |
| 2016 | 11 | 10 |
| 2017 | 19 | 26 |
| 2018 | 9 | 32 |
| 2019 | 24 | 34 |
| 2020 | 33 | 47 |
| 2021 | 25 | 29 |
| 2022 | 30 | 16 |
| 2023 | 35 | 40 |
| 2024 | 25 | 30 |
| 2025 | 28 | 21 |
| 2026 | 16 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Acoustic wave device1 Oct 2026US 2026/0303061 A1Murata Manufacturing Co., Ltd.
- Acoustic wave device, method for manufacturing acoustic wave device, and communication device10 Sep 2026US 2026/0269805 A1KYOCERA Corporation
- Filter structure integrated with ipd chip, packaging module, and manufacturing method13 Aug 2026US 2026/0240052 A1Vanchip (Tianjin) Technology Co., Ltd.
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Most cited
By later US patents
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Surface acoustic wave devices having a guard layer350US 5,699,027 AMatsushita Electric Industrial Co., Ltd. · 1997
- Piezoelectric device and method for producing same295US 7,427,824 B2Murata Manufacturing Co., Ltd. · 2008
- Method of assembling a wafer-level package filter288US 7,596,849 B1TriQuint Semiconductor, Inc. · 2009