H01S 5/02492
Cuw heat spreaders
Official title: {CuW heat spreaders}
H01S5/02492 (Cuw heat spreaders) appears on 77 US grants and 89 published applications in this corpus.
Search patents in H01S- Granted patents
- 77
- Published applications
- 89
- Assignees
- 62
- Inventors
- 237
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 3 | 8 |
| 2004 | 2 | 1 |
| 2005 | 4 | 3 |
| 2006 | 1 | 1 |
| 2007 | 2 | 7 |
| 2008 | 2 | 5 |
| 2009 | 4 | 2 |
| 2010 | 2 | 4 |
| 2011 | 5 | 8 |
| 2012 | 2 | 3 |
| 2013 | 6 | 5 |
| 2014 | 7 | 4 |
| 2015 | 2 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 2 | 8 |
| 2019 | 6 | 1 |
| 2020 | 4 | 8 |
| 2021 | 4 | 2 |
| 2022 | 5 | 5 |
| 2023 | 1 | 6 |
| 2024 | 4 | 2 |
| 2025 | 2 | 0 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing a semi-conductor laser arrangement, and semi-conductor laser arrangement14 Apr 2026US 12,603,473 B2ams-OSRAM International GmbH
- Photonic device with improved heat dissipation for III-V/Si heterogeneous laser and associated manufacturing method29 Jul 2025US 12,374,858 B2Scintil Photonics
- Heatsinking in laser devices25 Feb 2025US 12,237,643 B2Cisco Technology, Inc.
- Shared optic assembly for combined dot and flood illumination modules10 Dec 2024US 12,163,634 B2II-Vi Delaware, Inc.
- Systems and methods for laser diode array having integrated microchannel cooling16 Apr 2024US 11,962,129 B2Colorado State University Research Foundation
- Semiconductor laser device23 Jul 2026US 2026/0213488 A1Hamamatsu Photonics K.K.
- Current-confined multi-junction diode-laser bar23 Jul 2026US 2026/0213497 A1II-Vi Delaware, Inc.
- Semiconductor laser module, laser oscillator, and laser machining apparatus10 Oct 2024US 2024/0339809 A1Mitsubishi Electric Corporation
- Spacer for attaching coefficient of thermal expansion mismatched components6 Jun 2024US 2024/0186764 A1Lumentum Operations LLC
- Photonic device with improved heat dissipation for iii-v/si heterogeneous laser and associated manufacturing method28 Dec 2023US 2023/0420911 A1Scintil Photonics
Most cited
By later US patents
- Ribbed submounts for two dimensional stacked laser array71US 5,099,488 ASpectra Diode Laboratories, Inc. · 1992
- Laser diode array67US 5,305,344 AOpto Power Corporation · 1994
- Compact mid-IR laser45US 8,050,307 B2Daylight Solutions, Inc. · 2011
- Laser diode array packaging43US 5,835,518 AStar Medical Technologies, Inc. · 1998
- Compact mid-IR laser42US 7,492,806 B2Daylight Solutions, Inc. · 2009