Semiconductor laser module, laser oscillator, and laser machining apparatus
AssigneeMitsubishi Electric Corporation
InventorsYuki OKAMOTO, Daisuke MORITA
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AssigneeMitsubishi Electric Corporation
InventorsYuki OKAMOTO, Daisuke MORITA
Estimating the term…
A semiconductor laser module includes: a heat sink; a first electrode disposed in a first region of the heat sink; an insulating layer disposed on the first electrode; a submount disposed in a second region of the heat sink, the second region being different from the first region, the submount being electrically and thermally conductive; a laser diode element disposed on the submount, the laser diode element emitting a laser beam; a feed structure disposed on the laser diode element, the feed structure being electrically and thermally conductive; and a second electrode provided on the insulating layer and the feed structure such that the second electrode is in contact with the insulating layer and the feed structure. A positional relationship between the heat sink, the first electrode, the insulating layer, and the second electrode is fixed by an adhesive.
A semiconductor laser module comprising:
Dependencies are inferred from the claim text.