Systems and methods for laser diode array having integrated microchannel cooling

A laser diode system comprising:

• a laser diode substrate having a plurality of laser diode emitters supported on the laser diode substrate, and a facet at one end of each one of said plurality of said laser diode emitter from which a laser beam is emitted;
• a cooling subsystem in contact with the plurality of laser diode emitters and including a base portion and a plurality of cooling fluid flow channels formed by a plurality of elongated fins projecting outwardly from the base portion, the plurality of elongated fins being sufficient in number to span substantially a full width of all of the plurality of laser diode emitters and being laterally spaced apart from the laser diode substrate;
• the plurality of cooling fluid flow channels configured to circulate a cooling fluid therethrough to cool the plurality of laser diode emitters and the laser diode substrate on which the plurality of laser diode emitters is mounted;
• and
• wherein the cooling fluid flows over the facet of each one of the plurality of laser diode emitters.

A method for cooling a laser diode system, the method comprising:

• providing a substrate, a laser diode emitter supported on a surface of the substrate, and a facet at one end of the laser diode emitter from which a laser beam is emitted;
• arranging a cooling subsystem in contact with the surface of the substrate of the laser diode emitter;
• flowing a cooling fluid through elongated channels formed between fins of the cooling subsystem, where the fins project from a base portion of the cooling subsystem and are spaced laterally apart from the substrate;
• and
• wherein the cooling fluid flows over the facet of the at least one laser diode emitter and into the elongated channels.

A laser diode system comprising:

• a substrate having a laser diode emitter supported on a surface of the substrate, the laser diode emitter emitting a laser beam from a facet at one end of the laser diode emitter, along an axis parallel to the surface of the substrate;
• a cooling subsystem disposed in contact with the surface of the substrate of the laser diode emitter, the cooling subsystem including a plurality of cooling elements projecting outwardly and helping to at least partially define a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter and the substrate supporting the laser diode emitter, and the plurality of elongated channels further being laterally spaced apart from the substrate;
• and
• wherein the cooling fluid also flows over the facet of the laser diode emitter.