H01P 11/003
Manufacturing lines with conductors on a substrate
Official title: {Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines}
H01P11/003 (Manufacturing lines with conductors on a substrate) appears on 396 US grants and 406 published applications in this corpus.
Search patents in H01P- Granted patents
- 396
- Published applications
- 406
- Assignees
- 216
- Inventors
- 858
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 0 |
| 2002 | 6 | 8 |
| 2003 | 4 | 5 |
| 2004 | 7 | 17 |
| 2005 | 6 | 11 |
| 2006 | 9 | 8 |
| 2007 | 6 | 8 |
| 2008 | 4 | 3 |
| 2009 | 4 | 14 |
| 2010 | 9 | 9 |
| 2011 | 9 | 10 |
| 2012 | 8 | 11 |
| 2013 | 7 | 20 |
| 2014 | 10 | 13 |
| 2015 | 16 | 23 |
| 2016 | 30 | 23 |
| 2017 | 25 | 25 |
| 2018 | 22 | 21 |
| 2019 | 27 | 35 |
| 2020 | 32 | 41 |
| 2021 | 24 | 26 |
| 2022 | 28 | 26 |
| 2023 | 23 | 22 |
| 2024 | 21 | 15 |
| 2025 | 17 | 6 |
| 2026 | 11 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transmission line structure and fabricating method of the same8 Sep 2026US 12,731,879 B2Avary Holding (Shenzhen) Co., Limited.
- Semiconductor structure comprising first III-V compound layerand second III-V compound layer and method of manufacture8 Sep 2026US 12,733,193 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device30 Jun 2026US 12,671,160 B2Murata Manufacturing Co., Ltd.
- Waveguide structure26 May 2026US 12,640,454 B2Menlo Microsystems, Inc.
- Semiconductor structure and method of manufacture8 Oct 2026US 2026/0313943 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lossy matching network and wideband stabilizer30 Jul 2026US 2026/0221641 A1MACOM Technology Solutions Holdings, Inc.
- Apparatus and methods for compact transmission lines23 Jul 2026US 2026/0213390 A1Analog Devices, Inc.
- A radiofrequency circuit component16 Apr 2026US 2026/0106380 A1Qinetiq Limited
- Laminate substrate for a radiofrequency device2 Apr 2026US 2026/0096439 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Coaxial waveguide microstructures and methods of formation thereof292US 7,012,489 B2Rohm and Haas Electronic Materials LLC · 2006
- Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein206US 10,276,909 B2Invensas Bonding Technologies, Inc. · 2019
- Communication system having a coupler for guiding electromagnetic waves through interstitial areas formed by a plurality of stranded uninsulated conductors and method of use143US 10,505,252 B2AT&T Intellectual Property I, L. P. · 2019
- Wiring board, wiring board fabrication method, and semiconductor package112US 6,353,189 B1Kabushiki Kaisha Toshiba · 2002
- Coaxial waveguide microstructures having an active device and methods of formation thereof61US 7,148,772 B2Rohm and Haas Electronic Materials LLC · 2006