Laminate substrate for a radiofrequency device
AssigneeSTMicroelectronics International N.V.
InventorVipin VELAYUDHAN
Life of this patent
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Abstract
A laminate substrate for an RF application includes: a first metal layer in which is formed a first slot and a transmission line penetrating into the first slot; a second metal layer comprising a second laterally closed slot; a third metal layer comprising a third laterally closed slot; a fourth metal layer comprising a fourth slot; a dielectric layer being arranged between each metal layer; the second slot, the third slot, and the fourth slot forming a vertical RF feedthrough in the substrate; at least one of the third metal layer or the fourth metal layer having a portion protruding, respectively, into the third slot or into the fourth slot.
Claims18
A laminate substrate for an RF application comprising, from a first main side to a second main side:
- a first metal layer and a transmission line, a first slot open on one of its sides being formed in the first metal layer, the transmission line being coplanar with the first metal layer and penetrating into the first slot;
- a second metal layer comprising a second, laterally closed slot;
- a third metal layer comprising a third laterally closed slot;
- a fourth metal layer comprising a fourth slot;
- a dielectric layer being arranged between each metal layer;
- the second slot, the third slot, and the fourth slot forming a vertical RF feedthrough in the laminate substrate;
- and
- at least one of the third metal layer or of the fourth metal layer having a portion protruding, respectively, into the third slot or into the fourth slot.
Dependencies are inferred from the claim text.