H01J 37/36
For cleaning surfaces while plating with ions of materials introduced into the
Official title: for cleaning surfaces while plating with ions of materials introduced into the discharge, e.g. introduced by evaporation {(condensing of electrically charged vapour onto a surface for covering materials with metals C23C14/32)}
H01J37/36 (For cleaning surfaces while plating with ions of materials introduced into the) appears on 15 US grants and 16 published applications in this corpus.
Search patents in H01J- Granted patents
- 15
- Published applications
- 16
- Assignees
- 12
- Inventors
- 44
- Latest grant
- 2 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 2 |
| 2018 | 2 | 5 |
| 2019 | 1 | 2 |
| 2020 | 1 | 1 |
| 2021 | 3 | 2 |
| 2022 | 1 | 1 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- System and methods using an inline surface engineering source2 Jan 2024US 11,862,433 B2Varlan Semiconductor Equipment Associates, Inc.
- Bonding method for cleaning non-bonding surface of substrate11 Apr 2023US 11,626,302 B2Tokyo Electron Limited
- Bonding system with cleaning apparatus for cleaning non-bonding surface of substrate23 Aug 2022US 11,424,142 B2Tokyo Electron Limited
- Methods and devices for examining an electrically charged specimen surface9 Nov 2021US 11,170,970 B2Carl Zeiss SMT GmbH
- Process for coating a conductive component and conductive component coating27 Jul 2021US 11,072,850 B2Universidade Federal De Santa Catarina
- System And Methods Using An Inline Surface Engineering Source21 Mar 2024US 2024/0096602 A1Varian Semiconductor Equipment Associates, Inc.
- Thin-film deposition method and semiconductor device5 Jan 2023US 2023/0005741 A1Changxin Memory Technologies, Inc.
- Bonding method for cleaning non-bonding surface of substrate3 Nov 2022US 2022/0351987 A1Tokyo Electron Limited
- Process for coating a conductive component and conductive component coating18 Nov 2021US 2021/0355577 A1Universidade Federal De Santa Catarina
- System And Methods Using An Inline Surface Engineering Source7 Oct 2021US 2021/0313154 A1Varian Semiconductor Equipment Associates, Inc.
Most cited
By later US patents
- Gasless ion plating88US 4,039,416 A1977
- Hollow cathode discharge source of metal vapor49US 4,407,712 AThe United States of America as represented by the Secretary of the Army · 1983
- Arc source macroparticle filter32US 5,433,836 ACommonwealth Scientific and Industrial Research Organization · 1995
- High vacuum ion plating device22US 3,974,059 A1976
- Differentially pumped reactive gas injector11US 9,837,254 B2Lam Research Corporation · 2017