High vacuum ion plating device

Apparatus for plating a compound film of particles on the surface of a body comprising, in combination:

• an evaporation chamber adapted to be connected to a source of high vacuum;
• a plurality of evaporation means disposed in said evaporation chamber including:
• a plurality of crucibles for accommodating different kinds of evaporant materials, each of said crucibles having a top opening;
• an ionization chamber mounted in superimposed position over each of said crucibles, each of said ionization chambers having a passageway therethrough and connected with said top openings, each of said ionization chambers having a cylindrical coil-shaped filament for emitting electrons and an anode concentrically mounted within said filament for attracting said electrons, said filament and anode being disposed in said passageway;
• a high frequency coil being disposed in a superimposed relationship over said ionization chambers, said coil being connected to a high frequency electric power source located outside of said evaporation chamber;
• and a holder for supporting said body in a superimposed relationship over said high frequency coil and connected to a high tension electric power source located outside of said evaporation chamber;
• each associated evaporation means and ionization chamber forming a unit, each said unit being mounted with its axis tilted with respect to a vertical axis, said tilted axis being directed towards a substantially central portion of said holder.