H01J 37/31
For cutting or drilling
Official title: for cutting or drilling
H01J37/31 (For cutting or drilling) appears on 99 US grants and 107 published applications in this corpus.
Search patents in H01J- Granted patents
- 99
- Published applications
- 107
- Assignees
- 58
- Inventors
- 251
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 2 | 4 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 2 |
| 2011 | 1 | 0 |
| 2012 | 2 | 6 |
| 2013 | 7 | 7 |
| 2014 | 2 | 2 |
| 2015 | 2 | 10 |
| 2016 | 6 | 9 |
| 2017 | 9 | 8 |
| 2018 | 4 | 6 |
| 2019 | 10 | 8 |
| 2020 | 6 | 10 |
| 2021 | 9 | 8 |
| 2022 | 10 | 7 |
| 2023 | 3 | 5 |
| 2024 | 4 | 5 |
| 2025 | 5 | 2 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Charged particle beam device and sample analysis method9 Jun 2026US 12,651,723 B2Hitachi High-Tech Corporation
- Method for preparing TEM sample17 Mar 2026US 12,580,151 B2Shanghai Huali Integrated Circuit Corporation
- Focused ion beam system and method23 Dec 2025US 12,505,975 B2FEI Company
- System and method for uniform ion milling15 Jul 2025US 12,362,130 B2E. A. Fischione Instruments, Inc.
- Sample milling apparatus and method of adjustment therefor1 Apr 2025US 12,266,502 B2JEOL Ltd.
- Charged Particle Beam Apparatus and Sample Processing Method27 Aug 2026US 2026/0255914 A1Hitachi High-Tech Corporation
- Battery state control during cross-section beam milling18 Jun 2026US 2026/0171345 A1FEI Company
- Method for obtaining measurements of semiconductor structures from a single wedge cut of an inspection volume4 Jun 2026US 2026/0154808 A1
- Sample Holder, Sample Holder Set, Sample Milling Equipment, and Tightening Tool19 Mar 2026US 2026/0081102 A1JEOL Ltd.
- System and Method for Uniform Ion Milling13 Nov 2025US 2025/0349496 A1E. A. Fischione Instruments, Inc.
Most cited
By later US patents
- Method for separating specimen and method for analyzing the specimen separated by the specimen separating method131US 5,270,552 AHitachi, Ltd. · 1993
- Ion beam sputter-etched ventricular catheter for hydrocephalus shunt52US 4,377,169 A1983
- Method of precisely modifying predetermined surface layers of a workpiece by cluster ion impact therewith40US 4,559,096 AThe United States of America as represented by the United States Department of Energy · 1985
- Energy-beam engraving method and an apparatus for carrying it out29US 4,028,523 ASteigerwald Strahltechnik GmbH · 1977
- Device for manual electron beam processing of materials in space29US 5,869,801 AE. O. Paton Electric Welding Institute of the National Academy of Sciences of Ukraine · 1999