H01G 4/228
Terminals
H01G4/228 (Terminals) appears on 4,799 US grants and 5,669 published applications in this corpus.
Search patents in H01G- Granted patents
- 4,799
- Published applications
- 5,669
- Assignees
- 669
- Inventors
- 5,647
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 10 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 8 | 0 |
| 1984 | 18 | 0 |
| 1985 | 22 | 0 |
| 1986 | 26 | 0 |
| 1987 | 12 | 0 |
| 1988 | 18 | 0 |
| 1989 | 28 | 0 |
| 1990 | 16 | 0 |
| 1991 | 14 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 9 | 0 |
| 1996 | 9 | 0 |
| 1997 | 9 | 0 |
| 1998 | 10 | 0 |
| 1999 | 15 | 0 |
| 2000 | 16 | 0 |
| 2001 | 37 | 21 |
| 2002 | 44 | 27 |
| 2003 | 36 | 38 |
| 2004 | 33 | 56 |
| 2005 | 49 | 73 |
| 2006 | 71 | 89 |
| 2007 | 65 | 114 |
| 2008 | 69 | 124 |
| 2009 | 82 | 121 |
| 2010 | 76 | 105 |
| 2011 | 88 | 80 |
| 2012 | 102 | 107 |
| 2013 | 93 | 138 |
| 2014 | 99 | 190 |
| 2015 | 154 | 255 |
| 2016 | 214 | 268 |
| 2017 | 231 | 326 |
| 2018 | 282 | 350 |
| 2019 | 386 | 350 |
| 2020 | 348 | 401 |
| 2021 | 333 | 361 |
| 2022 | 339 | 387 |
| 2023 | 355 | 422 |
| 2024 | 319 | 421 |
| 2025 | 370 | 448 |
| 2026 | 235 | 397 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01G 4/232Electrically connecting two or more layers of a stacked or rolled capacitor3,666
- H01G 4/248The terminals embracing or surrounding the capacitive element915
- H01G 4/236Leading through the housing, i.e. lead-through302
- H01G 4/252The terminals being coated on the capacitive element107
- H01G 4/242The capacitive element surrounding the terminal54
Recent patents
- Video surveillance playback system with multi-tiered storage6 Oct 2026US 12,755,902 B2Cozaint Corporation
- Capacitor having a support part joined to a capacitance forming part6 Oct 2026US 12,755,903 B2Murata Manufacturing Co., Ltd.
- Electronic component with surface electrode layer6 Oct 2026US 12,755,904 B2TDK Corporation
- Multilayer ceramic capacitor with external electrode having a carbon layer6 Oct 2026US 12,755,905 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayered capacitor and manufacturing method thereof29 Sep 2026US 12,749,623 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor8 Oct 2026US 2026/0311934 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor1 Oct 2026US 2026/0302063 A1Murata Manufacturing Co., Ltd.
- Multilayer electronic component1 Oct 2026US 2026/0302066 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic component1 Oct 2026US 2026/0302069 A1Murata Manufacturing Co., Ltd.
- Electronic component and board having electronic component mounted thereon1 Oct 2026US 2026/0302070 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Chip capacitors and chip capacitor electromagnetic interference filters257US 5,973,906 AMaxwell Energy Products, Inc. · 1999
- EMI filter terminal assembly with wire bond pads for human implant applications157US 7,038,900 B2Greatbatch-Sierra, Inc. · 2006
- Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same150US 6,606,237 B1Intel Corporation · 2003
- Integrated broadband ceramic capacitor array144US 6,587,327 B12003
- Apparatus and process for reducing the susceptibility of active implantable medical devices to medical procedures such as magnetic resonance imaging134US 7,489,495 B2Greatbatch-Sierra, Inc. · 2009