H01G 4/248
The terminals embracing or surrounding the capacitive element
Official title: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
H01G4/248 (The terminals embracing or surrounding the capacitive element) appears on 915 US grants and 1,076 published applications in this corpus.
Search patents in H01G- Granted patents
- 915
- Published applications
- 1,076
- Assignees
- 95
- Inventors
- 1,335
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 3 |
| 2004 | 2 | 0 |
| 2005 | 3 | 5 |
| 2006 | 3 | 3 |
| 2007 | 3 | 2 |
| 2008 | 3 | 7 |
| 2009 | 2 | 3 |
| 2010 | 2 | 1 |
| 2011 | 3 | 2 |
| 2012 | 3 | 5 |
| 2013 | 0 | 7 |
| 2014 | 4 | 9 |
| 2015 | 15 | 68 |
| 2016 | 35 | 55 |
| 2017 | 68 | 92 |
| 2018 | 73 | 115 |
| 2019 | 128 | 104 |
| 2020 | 111 | 111 |
| 2021 | 74 | 93 |
| 2022 | 96 | 109 |
| 2023 | 104 | 77 |
| 2024 | 76 | 58 |
| 2025 | 74 | 58 |
| 2026 | 17 | 88 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer electronic component11 Aug 2026US 12,706,245 B2KYOCERA Corporation
- Multilayer ceramic capacitor and multilayer ceramic capacitor-mounted structure30 Jun 2026US 12,671,032 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor23 Jun 2026US 12,665,130 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor23 Jun 2026US 12,665,135 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor with patterned electrodes16 Jun 2026US 12,658,372 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor1 Oct 2026US 2026/0302063 A1Murata Manufacturing Co., Ltd.
- Multilayer electronic component1 Oct 2026US 2026/0302066 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor24 Sep 2026US 2026/0290687 A1Murata Manufacturing Co., Ltd.
- Multilayer electronic component24 Sep 2026US 2026/0290688 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component24 Sep 2026US 2026/0290697 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board79US 6,876,554 B1Ibiden Co., Ltd. · 2005
- Miniature surface mount capacitor and method of making same73US 6,144,547 AAVX Corporation · 2000
- Printed circuit board and method for manufacturing printed circuit board46US 7,307,852 B2Ibiden Co., Ltd. · 2007
- Ceramic electronic component42US 10,366,834 B1Samsung Electro-Mechanics Co., Ltd. · 2019
- Multilayer ceramic capacitor with foil terminal26US 4,346,429 AUnion Carbide Corporation · 1982