Ceramic electronic component

A ceramic electronic component, comprising:

• a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;
• a first external electrode including a first electrode layer disposed on the third surface of the body and electrically connected to the first internal electrode, a first inorganic insulating layer disposed on the first electrode layer, and a first plating layer disposed on the first inorganic insulating layer;
• a second external electrode including a second electrode layer disposed on the fourth surface of the body and electrically connected to the second internal electrode, a second inorganic insulating layer disposed on the second electrode layer, and a second plating layer disposed on the second inorganic insulating layer;
• and
• a third inorganic insulating layer disposed on the first, second, fifth, and sixth surfaces of the body and connected to the first and second inorganic insulating layers,
• wherein the first, second, and third inorganic insulating layers comprise at least one selected from the group of SiO2, Al2O3 and ZrO2, and the first, second, and third inorganic insulating layers have a thickness within a range from 20 nm to 150 nm, and
• wherein the first and second inorganic insulating layers have an, opening formed therein, and the first and second plating layers are in direct contact with the first and second electrode layers through the opening, respectively.