H01G 4/242
The capacitive element surrounding the terminal
Official title: the capacitive element surrounding the terminal
H01G4/242 (The capacitive element surrounding the terminal) appears on 54 US grants and 56 published applications in this corpus.
Search patents in H01G- Granted patents
- 54
- Published applications
- 56
- Assignees
- 36
- Inventors
- 158
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 2 |
| 2006 | 0 | 0 |
| 2007 | 2 | 2 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 2 | 3 |
| 2017 | 2 | 6 |
| 2018 | 6 | 6 |
| 2019 | 4 | 8 |
| 2020 | 4 | 1 |
| 2021 | 3 | 3 |
| 2022 | 3 | 5 |
| 2023 | 3 | 2 |
| 2024 | 1 | 5 |
| 2025 | 9 | 1 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bus capacitor of an electronic device, and automobile having same19 May 2026US 12,633,463 B2BYD Company Limited
- Bushing comprising low-viscosity insulating fluid and electrical facility with bushing17 Mar 2026US 12,580,103 B2Hitachi Energy Ltd
- Bushing and method for producing a bushing21 Oct 2025US 12,451,274 B2Hitachi Energy Ltd
- Capacitor array19 Aug 2025US 12,394,574 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor including conductive vias12 Aug 2025US 12,387,878 B2KYOCERA AVX Components Corporation
- Multi-unit multilayer ceramic capacitor10 Sep 2026US 2026/0269136 A1Murata Manufacturing Co., Ltd.
- Multilayer Ceramic Capacitor Including Conductive Vias18 Jun 2026US 2026/0171320 A1KYOCERA AVX Components Corporation
- Multilayer ceramic electronic component11 Jun 2026US 2026/0162897 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic electronic component11 Jun 2026US 2026/0162900 A1Murata Manufacturing Co., Ltd.
- Ground Connection Made By A Notch In The Outer Diameter Of A Ceramic Insulator For An Internally Grounded Filter Feedthrough9 Apr 2026US 2026/0100687 A1Greatbatch Ltd.
Most cited
By later US patents
- Method of attaching a capacitor to a feedthrough assembly of a medical device26US 7,281,305 B1Medtronic, Inc. · 2007
- Method for producing capacitors and ceramic body therefore17US 4,071,878 AN L Industries, Inc. · 1978
- Capacitor with a geometrical layout14US 6,974,994 B1Advanic Technologies Inc. · 2005
- Filtered feedthrough assembly and method of manufacture14US 7,748,093 B2Medtronic, Inc. · 2010
- Dual mica capacitor7US 4,124,876 ASociete Anonyme de Telecommunications · 1978