Multilayer ceramic capacitor including conductive vias

An electronic device comprising:

• a circuit board;
• an integrated circuit package;
• and
• a multilayer ceramic capacitor positioned between the circuit board and the integrated circuit package and directly connected to both the circuit board and the integrated circuit package, wherein the multilayer ceramic capacitor comprises:
• a top surface, a bottom surface, and at least one side surface connecting the top surface and the bottom surface,
• a main body containing a plurality of alternating dielectric layers and internal electrode layers comprising a first plurality of internal electrode layers and a second plurality of internal electrode layers,
• wherein the first plurality of internal electrode layers comprises a first active electrode and a first anchor electrode,
• a first through-hole conductive via electrically connecting the first plurality of internal electrode layers to a first external terminal on the top surface and a first external terminal on the bottom surface of the capacitor, and
• a second through-hole conductive via electrically connecting the second plurality of internal electrode layers to a second external terminal on the top surface and a second external terminal on the bottom surface of the capacitor, and
• wherein the at least one side surface does not include an external terminal, and
• wherein the direct connection with one of the circuit board or the integrated circuit package is via the first external terminal and the second external terminal on the top surface of the capacitor and the direct connection with the other of the circuit board or the integrated circuit package is via the first external terminal and the second external terminal on the bottom surface of the capacitor.