Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same

A capacitor comprising:

• a first tier of capacitance, which includes multiple first layers of patterned conductive material separated by layers of dielectric material;
• a first number of first capacitor vias, which extend from a top surface of the capacitor through the multiple first layers, wherein some of the first capacitor vias make electrical contact with every other one of the multiple first layers, and others of the first capacitor vias make electrical contact with a remainder of the multiple first layers;
• a second tier of capacitance, electrically connected to the first tier of capacitance, which includes multiple second layers of patterned conductive material;
• a second number of second capacitor vias, which extend through the multiple second layers, wherein some of the second capacitor vias make electrical contact with every other one of the multiple second layers, and others of the second capacitor vias make electrical contact with a remainder of the multiple second layers;
• and
• a first side surface terminal electrode and a second side surface terminal electrode disposed on at least one side surface of the capacitor, wherein the first side surface terminal electrode makes electrical contact with some of the multiple first layers and multiple second layers, and the second side surface terminal electrode makes electrical contact with others of the multiple first layers and multiple second layers.

A method for fabricating a capacitor, the method comprising:

• fabricating a multi-layer structure, which includes a first tier of capacitance and a second tier of capacitance electrically connected to the first tier of capacitance, the first tier having multiple first layers of patterned conductive material separated by layers of dielectric material, and the second tier having multiple second layers of patterned conductive material;
• forming a first number of first capacitor vias, which extend from a top surface of the capacitor through the multiple first layers, wherein some of the first capacitor vias make electrical contact with every other one of the multiple first layers, and others of the first capacitor vias make electrical contact with a remainder of the multiple first layers;
• and
• forming a first side surface terminal electrode and a second side surface terminal electrode disposed on at least one side surface of the capacitor, wherein the first side surface terminal electrode makes electrical contact with some of the multiple first layers and multiple second layers, and the second side surface terminal electrode makes electrical contact with others of the multiple first layers and multiple second layers.