H01G 4/232
Electrically connecting two or more layers of a stacked or rolled capacitor
Official title: electrically connecting two or more layers of a stacked or rolled capacitor
H01G4/232 (Electrically connecting two or more layers of a stacked or rolled capacitor) appears on 3,666 US grants and 4,476 published applications in this corpus.
Search patents in H01G- Granted patents
- 3,666
- Published applications
- 4,476
- Assignees
- 398
- Inventors
- 3,835
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 6 | 0 |
| 1985 | 8 | 0 |
| 1986 | 16 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 14 | 0 |
| 1990 | 10 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 6 | 0 |
| 2000 | 13 | 0 |
| 2001 | 27 | 14 |
| 2002 | 34 | 18 |
| 2003 | 25 | 22 |
| 2004 | 22 | 36 |
| 2005 | 26 | 38 |
| 2006 | 43 | 64 |
| 2007 | 45 | 74 |
| 2008 | 49 | 83 |
| 2009 | 58 | 87 |
| 2010 | 51 | 78 |
| 2011 | 55 | 51 |
| 2012 | 73 | 73 |
| 2013 | 64 | 103 |
| 2014 | 71 | 151 |
| 2015 | 111 | 193 |
| 2016 | 170 | 215 |
| 2017 | 165 | 244 |
| 2018 | 215 | 277 |
| 2019 | 318 | 264 |
| 2020 | 281 | 350 |
| 2021 | 281 | 295 |
| 2022 | 279 | 328 |
| 2023 | 308 | 348 |
| 2024 | 267 | 348 |
| 2025 | 307 | 391 |
| 2026 | 178 | 331 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic component with surface electrode layer6 Oct 2026US 12,755,904 B2TDK Corporation
- Multilayer ceramic capacitor with external electrode having a carbon layer6 Oct 2026US 12,755,905 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayered capacitor and manufacturing method thereof29 Sep 2026US 12,749,623 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic component including metal terminals including intermetallic compound29 Sep 2026US 12,749,624 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic electronic component including metal terminals and protruding portions29 Sep 2026US 12,749,626 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor8 Oct 2026US 2026/0311934 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor1 Oct 2026US 2026/0302063 A1Murata Manufacturing Co., Ltd.
- Multilayer electronic component1 Oct 2026US 2026/0302066 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic component1 Oct 2026US 2026/0302069 A1Murata Manufacturing Co., Ltd.
- Electronic component and board having electronic component mounted thereon1 Oct 2026US 2026/0302070 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Chip capacitors and chip capacitor electromagnetic interference filters257US 5,973,906 AMaxwell Energy Products, Inc. · 1999
- Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same150US 6,606,237 B1Intel Corporation · 2003
- Apparatus and process for reducing the susceptibility of active implantable medical devices to medical procedures such as magnetic resonance imaging134US 7,489,495 B2Greatbatch-Sierra, Inc. · 2009
- Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor127US 6,952,049 B1Ngk Spark Plug Co., Ltd. · 2005
- System and method of plating ball grid array and isolation features for electronic components120US 7,463,474 B2AVX Corporation · 2008