H01G 4/2325
Characterised by the material of the terminals
Official title: {characterised by the material of the terminals}
H01G4/2325 (Characterised by the material of the terminals) appears on 1,274 US grants and 1,670 published applications in this corpus.
Search patents in H01G- Granted patents
- 1,274
- Published applications
- 1,670
- Assignees
- 108
- Inventors
- 1,696
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 6 | 0 |
| 1985 | 2 | 0 |
| 1986 | 14 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 9 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 6 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 0 |
| 2003 | 1 | 3 |
| 2004 | 2 | 8 |
| 2005 | 2 | 7 |
| 2006 | 8 | 10 |
| 2007 | 4 | 11 |
| 2008 | 9 | 16 |
| 2009 | 10 | 17 |
| 2010 | 11 | 13 |
| 2011 | 2 | 10 |
| 2012 | 18 | 10 |
| 2013 | 10 | 35 |
| 2014 | 12 | 42 |
| 2015 | 28 | 50 |
| 2016 | 53 | 50 |
| 2017 | 33 | 72 |
| 2018 | 60 | 70 |
| 2019 | 86 | 87 |
| 2020 | 86 | 128 |
| 2021 | 106 | 135 |
| 2022 | 126 | 146 |
| 2023 | 146 | 190 |
| 2024 | 133 | 201 |
| 2025 | 158 | 185 |
| 2026 | 99 | 173 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Multilayer ceramic electronic component including metal terminals including intermetallic compound29 Sep 2026US 12,749,624 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor15 Sep 2026US 12,738,418 B2Murata Manufacturing Co., Ltd.
- Multi-layer ceramic electronic component15 Sep 2026US 12,738,423 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic capacitor8 Oct 2026US 2026/0311934 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic electronic component1 Oct 2026US 2026/0302069 A1Murata Manufacturing Co., Ltd.
- Electronic component and board having electronic component mounted thereon1 Oct 2026US 2026/0302070 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component and board having the same mounted thereon1 Oct 2026US 2026/0302072 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic component1 Oct 2026US 2026/0302074 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Electric element incorporating wiring board108US 6,370,013 B1KYOCERA Corporation · 2002
- Multilayer ceramic chip capacitor and a process for its manufacture98US 5,712,758 ARohm Co., Ltd. · 1998
- Multilayer ceramic capacitor with terminal formed by electroless plating89US 7,345,868 B2Presidio Components, Inc. · 2008
- Electronic device, and its fabrication method77US 6,124,769 ATDK Corporation · 2000
- Ceramic capacitor57US 4,604,676 AMurata Manufacturing Co., Ltd. · 1986