Electronic device, and its fabrication method
AssigneeTDK Corporation
InventorsKatsuhiko Igarashi, Sunao Masuda, Tomoko Uchida, Yasumichi Tokuoka, Shigeki Sato
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AssigneeTDK Corporation
InventorsKatsuhiko Igarashi, Sunao Masuda, Tomoko Uchida, Yasumichi Tokuoka, Shigeki Sato
Estimating the term…
The invention provides an electronic device comprising a first metal layer containing a first metal converted into an oxide upon firing in an oxidizing atmosphere and a second metal layer formed by firing of a second metal particle containing a metal that is not oxidized upon firing in an oxidizing atmosphere, with an intermediate oxide layer interleaved between these two metal layers. The intermediate oxide layer contains an oxide of the first metal contained in the first metal layer. Preferably, the second metal particle contained in the second metal layer is dispersed in the intermediate oxide layer. A uniform oxide layer is obtained at a simple step, and the resistance value provided by the oxide layer is easily controllable with high precision. It is thus possible to achieve an electronic device in which the bonding strength of the oxide layer with respect to the other metal-containing layer is improved with an improvement in the bonding strength with respect to lead wires.
An electronic device comprising a first metal layer containing at least a metal and a second metal layer formed by firing of a metal particle, with an intermediate oxide layer interleaved between said two metal layers, wherein:
An electronic device comprising a first metal layer containing a first metal which provides an oxide upon firing in an oxidizing atmosphere and a second metal layer formed by firing of particles of a second metal which is not oxidized even upon firing in an oxidizing atmosphere, with an intermediate oxide layer interleaved between said two metal layers, wherein:
Dependencies are inferred from the claim text.