H01G 4/252
The terminals being coated on the capacitive element
Official title: the terminals being coated on the capacitive element (H01G4/232 takes precedence)
H01G4/252 (The terminals being coated on the capacitive element) appears on 107 US grants and 150 published applications in this corpus.
Search patents in H01G- Granted patents
- 107
- Published applications
- 150
- Assignees
- 43
- Inventors
- 328
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 3 |
| 2006 | 4 | 2 |
| 2007 | 1 | 4 |
| 2008 | 0 | 4 |
| 2009 | 5 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 3 |
| 2013 | 0 | 2 |
| 2014 | 2 | 3 |
| 2015 | 2 | 5 |
| 2016 | 8 | 4 |
| 2017 | 3 | 6 |
| 2018 | 4 | 11 |
| 2019 | 6 | 14 |
| 2020 | 13 | 5 |
| 2021 | 9 | 12 |
| 2022 | 10 | 19 |
| 2023 | 10 | 11 |
| 2024 | 7 | 15 |
| 2025 | 13 | 13 |
| 2026 | 9 | 13 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Multilayer ceramic capacitor29 Sep 2026US 12,749,627 B2Murata Manufacturing Co., Ltd.
- Method of making a capacitor1 Sep 2026US 12,725,734 B2Saras Micro Devices, Inc.
- Multilayer ceramic capacitor18 Aug 2026US 12,712,125 B2Murata Manufacturing Co., Ltd.
- Circuit board2 Jun 2026US 12,648,085 B2TDK Corporation
- Capacitor device and method for manufacturing the same21 Apr 2026US 12,609,246 B2AP Memory Technology Corp.
- Multilayer ceramic capacitor27 Aug 2026US 2026/0253795 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor20 Aug 2026US 2026/0245801 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor20 Aug 2026US 2026/0245802 A1Murata Manufacturing Co., Ltd.
- Capacitor23 Jul 2026US 2026/0213070 A1Nichicon Corporation
- Capacitor wafer and method for manufacturing the same23 Jul 2026US 2026/0213075 A1AP Memory Technology Corp.
Most cited
By later US patents
- EMI filter terminal assembly with wire bond pads for human implant applications157US 7,038,900 B2Greatbatch-Sierra, Inc. · 2006
- EMI filter terminal assembly with wire bond pads for human implant applications124US 7,310,216 B2Greatbatch-Sierra, Inc. · 2007
- Feedthrough terminal assembly with lead wire bonding pad for human implant applications80US 7,012,192 B22006
- High-density metal-insulator-metal capacitors9US 10,580,581 B2Globalfoundries Inc. · 2020
- Metallized film capacitor9US 7,027,286 B2Matsushita Electric Industrial Co., Ltd. · 2006