H01G 4/236
Leading through the housing, i.e. lead-through
Official title: leading through the housing, i.e. lead-through
H01G4/236 (Leading through the housing, i.e. lead-through) appears on 302 US grants and 341 published applications in this corpus.
Search patents in H01G- Granted patents
- 302
- Published applications
- 341
- Assignees
- 118
- Inventors
- 613
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 2 | 5 |
| 2006 | 3 | 5 |
| 2007 | 8 | 12 |
| 2008 | 5 | 9 |
| 2009 | 7 | 12 |
| 2010 | 6 | 9 |
| 2011 | 11 | 5 |
| 2012 | 6 | 5 |
| 2013 | 7 | 7 |
| 2014 | 7 | 9 |
| 2015 | 6 | 13 |
| 2016 | 16 | 13 |
| 2017 | 10 | 15 |
| 2018 | 20 | 26 |
| 2019 | 19 | 27 |
| 2020 | 21 | 29 |
| 2021 | 26 | 19 |
| 2022 | 23 | 22 |
| 2023 | 18 | 17 |
| 2024 | 14 | 20 |
| 2025 | 28 | 45 |
| 2026 | 20 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Video surveillance playback system with multi-tiered storage6 Oct 2026US 12,755,902 B2Cozaint Corporation
- Multilayer ceramic electronic component including metal terminals including intermetallic compound29 Sep 2026US 12,749,624 B2Murata Manufacturing Co., Ltd.
- Film capacitor having bent lead wires and capacitor module29 Sep 2026US 12,749,625 B2LG Innotek Co., Ltd.
- Multilayer ceramic electronic component including metal terminals and protruding portions29 Sep 2026US 12,749,626 B2Murata Manufacturing Co., Ltd.
- Mobile device and wound capacitor package structure thereof15 Sep 2026US 12,738,422 B2Apaq Technology Co., Ltd.
- Electronic component17 Sep 2026US 2026/0279674 A1TDK Corporation
- Electronic component17 Sep 2026US 2026/0279675 A1TDK Corporation
- Electronic component17 Sep 2026US 2026/0279676 A1TDK Corporation
- Electronic component17 Sep 2026US 2026/0279677 A1TDK Corporation
- Electronic component10 Sep 2026US 2026/0269137 A1TDK Corporation
Most cited
By later US patents
- EMI filter terminal assembly with wire bond pads for human implant applications157US 7,038,900 B2Greatbatch-Sierra, Inc. · 2006
- Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor127US 6,952,049 B1Ngk Spark Plug Co., Ltd. · 2005
- EMI filter terminal assembly with wire bond pads for human implant applications124US 7,310,216 B2Greatbatch-Sierra, Inc. · 2007
- Capacitor for multiple replacement applications107US 7,203,053 B2American Radionic Company, Inc. · 2007
- Capacitor for multiple replacement applications94US 7,474,519 B2American Radionic Company, Inc. · 2009