US 12,738,422 B2Granted

Mobile device and wound capacitor package structure thereof

AssigneeApaq Technology Co., Ltd.

InventorsChung-Jui Su, Ming-Tsung Liang

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Abstract

A mobile device and a wound capacitor package structure thereof are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly and a packaging assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The packaging assembly includes a filling body for completely encapsulating the wound assembly, and a single-piece packaging casing for accommodating the filling body. The filling body includes a bottom filling material layer configured to encapsulate the wound assembly and a part of the conductive assembly. The single-piece packaging casing has an annular deformation structure configured for surroundingly accommodating the top filling material layer. The top filling material layer of the filling body cannot be squeezed by the annular deformation structure, and the first conductive pin and the second conductive pin of the conductive assembly cannot be offset relative to the wound assembly by the annular deformation structure.

Claims10

Dependent claims

A wound capacitor package structure, comprising:

a wound assembly including a wound positive conductive foil, a wound negative conductive foil and two wound separators;
a conductive assembly including a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound negative conductive foil;
a packaging assembly configured to completely encapsulate the wound assembly;
and
a bottom seat plate configured on a bottom side of the packaging assembly for cooperating with the packaging assembly;
wherein one of the two wound separators is disposed between the wound positive conductive foil and the wound negative conductive foil, and one of the wound positive conductive foil and the wound negative conductive foil is disposed between the two wound separators;
wherein the first conductive pin includes a first embedded portion accommodated inside the packaging assembly and a first exposed portion exposed outside the packaging assembly, and the second conductive pin includes a second embedded portion accommodated inside the packaging assembly and a second exposed portion exposed outside the packaging assembly;
wherein the packaging assembly includes a filling body for completely encapsulating the wound assembly and a single-piece packaging casing for accommodating the filling body;
wherein the filling body includes a bottom filling material layer and a top filling material layer connected to the bottom filling material layer, the bottom filling material layer is configured to encapsulate a first portion of the wound assembly, and the top filling material layer is configured to encapsulate a second portion of the wound assembly, the first embedded portion of the first conductive pin and the second embedded portion of the second conductive pin;
wherein the single-piece packaging casing has an annular upright structure and an annular deformation structure connected to the annular upright structure, the annular upright structure is configured for surroundingly accommodating the bottom filling material layer and a first portion of the top filling material layer, and the annular deformation structure is configured for surroundingly accommodating a second portion of the top filling material layer;
wherein the top filling material layer of the filling body is not squeezed by the annular deformation structure, and the first conductive pin and the second conductive pin of the conductive assembly are not offset relative to the wound assembly by the annular deformation structure.

8 more elements

A wound capacitor package structure, comprising:

a wound assembly;
a conductive assembly including a first conductive pin electrically contacting the wound assembly and a second conductive pin electrically contacting the wound assembly;
and
a packaging assembly configured to completely encapsulate the wound assembly;
wherein the first conductive pin includes a first embedded portion accommodated inside the packaging assembly and a first exposed portion exposed outside the packaging assembly, and the second conductive pin includes a second embedded portion accommodated inside the packaging assembly and a second exposed portion exposed outside the packaging assembly;
wherein the packaging assembly includes a filling body for completely encapsulating the wound assembly and a single-piece packaging casing for accommodating the filling body;
wherein the filling body includes a bottom filling material layer and a top filling material layer connected to the bottom filling material layer, the bottom filling material layer is configured to encapsulate a first portion of the wound assembly, and the top filling material layer is configured to encapsulate a second portion of the wound assembly, the first embedded portion of the first conductive pin and the second embedded portion of the second conductive pin;
wherein the single-piece packaging casing has an annular upright structure and an annular deformation structure connected to the annular upright structure, the annular upright structure is configured for surroundingly accommodating the bottom filling material layer and a first portion of the top filling material layer, and the annular deformation structure is configured for surroundingly accommodating a second portion of the top filling material layer;
wherein the top filling material layer of the filling body is not squeezed by the annular deformation structure, and the first conductive pin and the second conductive pin of the conductive assembly are not offset relative to the wound assembly by the annular deformation structure.

6 more elements

A mobile device configured to use a wound capacitor package structure, characterized in that the wound capacitor package structure comprises:

a wound assembly;
a conductive assembly including a first conductive pin electrically contacting the wound assembly and a second conductive pin electrically contacting the wound assembly;
and
a packaging assembly configured to completely encapsulate the wound assembly;
wherein the first conductive pin includes a first embedded portion accommodated inside the packaging assembly and a first exposed portion exposed outside the packaging assembly, and the second conductive pin includes a second embedded portion accommodated inside the packaging assembly and a second exposed portion exposed outside the packaging assembly;
wherein the packaging assembly includes a filling body for completely encapsulating the wound assembly and a single-piece packaging casing for accommodating the filling body;
wherein the filling body includes a bottom filling material layer and a top filling material layer connected to the bottom filling material layer, the bottom filling material layer is configured to encapsulate a first portion of the wound assembly, and the top filling material layer is configured to encapsulate a second portion of the wound assembly, the first embedded portion of the first conductive pin and the second embedded portion of the second conductive pin;
wherein the single-piece packaging casing has an annular upright structure and an annular deformation structure connected to the annular upright structure, the annular upright structure is configured for surroundingly accommodating the bottom filling material layer and a first portion of the top filling material layer, and the annular deformation structure is configured for surroundingly accommodating a second portion of the top filling material layer;
wherein the top filling material layer of the filling body is not squeezed by the annular deformation structure, and the first conductive pin and the second conductive pin of the conductive assembly are not offset relative to the wound assembly by the annular deformation structure.

6 more elements

Dependencies are inferred from the claim text.