H01G 2/06
Specially adapted for mounting on a printed-circuit support
Official title: specially adapted for mounting on a printed-circuit support
H01G2/06 (Specially adapted for mounting on a printed-circuit support) appears on 1,395 US grants and 1,588 published applications in this corpus.
Search patents in H01G- Granted patents
- 1,395
- Published applications
- 1,588
- Assignees
- 286
- Inventors
- 2,255
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 4 | 0 |
| 1985 | 8 | 0 |
| 1986 | 8 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 9 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 1 |
| 2002 | 12 | 9 |
| 2003 | 11 | 11 |
| 2004 | 14 | 17 |
| 2005 | 19 | 22 |
| 2006 | 24 | 20 |
| 2007 | 14 | 27 |
| 2008 | 21 | 34 |
| 2009 | 14 | 21 |
| 2010 | 17 | 20 |
| 2011 | 21 | 17 |
| 2012 | 25 | 29 |
| 2013 | 10 | 31 |
| 2014 | 25 | 75 |
| 2015 | 52 | 126 |
| 2016 | 82 | 87 |
| 2017 | 92 | 86 |
| 2018 | 82 | 101 |
| 2019 | 101 | 100 |
| 2020 | 106 | 96 |
| 2021 | 81 | 130 |
| 2022 | 103 | 128 |
| 2023 | 119 | 135 |
| 2024 | 104 | 100 |
| 2025 | 94 | 92 |
| 2026 | 58 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic component with surface electrode layer6 Oct 2026US 12,755,904 B2TDK Corporation
- Thin film capacitor having a metal foil with roughened main surfaces, manufacturing method therefor, and electronic circuit board having the thin film capacitor6 Oct 2026US 12,755,907 B2TDK Corporation
- Multilayer ceramic electronic component including metal terminals including intermetallic compound29 Sep 2026US 12,749,624 B2Murata Manufacturing Co., Ltd.
- Film capacitor having bent lead wires and capacitor module29 Sep 2026US 12,749,625 B2LG Innotek Co., Ltd.
- Multilayer ceramic capacitor29 Sep 2026US 12,749,627 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor24 Sep 2026US 2026/0290687 A1Murata Manufacturing Co., Ltd.
- Electronic component17 Sep 2026US 2026/0279662 A1TDK Corporation
- Mounting structure for electronic component17 Sep 2026US 2026/0279663 A1Murata Manufacturing Co., Ltd.
- Multilayer electronic component and board having the same mounted thereon17 Sep 2026US 2026/0279672 A1Samsung Electro-Mechanics Co., Ltd.
- Mounting structure for electronic component10 Sep 2026US 2026/0269123 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Surface mount multilayer capacitor138US 6,243,253 B1AVX Corporation · 2001
- Capacitor unit100US 7,547,233 B2Panasonic Corporation · 2009
- Passive component87US 5,921,820 ABC Components Holdings B.V. · 1999
- Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board79US 6,876,554 B1Ibiden Co., Ltd. · 2005