Multilayer electronic component and board having the same mounted thereon

A multilayer electronic component, comprising:

• a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a thickness direction, the body including first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a width direction;
• a first external electrode including a first connection portion disposed on the third surface, and a first band portion disposed to extend from the first connection portion to a portion of the first and second surfaces;
• a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion disposed to extend from the second connection portion to a portion of the first and second surfaces;
• a first connection terminal disposed to be in contact with the first band portion, and including a first recess portion in a region recessed toward the third surface;
• and
• a second connection terminal disposed to be in contact with the second band portion, and including a second recess portion in a region recessed toward the fourth surface, wherein a maximum length of the first and second recess portions in the length direction is 100 μm or more.