H01G 2/065
For surface mounting
Official title: {for surface mounting, e.g. chip capacitors}
H01G2/065 (For surface mounting) appears on 816 US grants and 907 published applications in this corpus.
Search patents in H01G- Granted patents
- 816
- Published applications
- 907
- Assignees
- 137
- Inventors
- 1,310
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 9 | 6 |
| 2003 | 7 | 7 |
| 2004 | 12 | 13 |
| 2005 | 15 | 16 |
| 2006 | 17 | 12 |
| 2007 | 7 | 17 |
| 2008 | 15 | 17 |
| 2009 | 8 | 11 |
| 2010 | 7 | 7 |
| 2011 | 9 | 8 |
| 2012 | 8 | 14 |
| 2013 | 6 | 13 |
| 2014 | 8 | 40 |
| 2015 | 28 | 76 |
| 2016 | 54 | 48 |
| 2017 | 50 | 39 |
| 2018 | 38 | 39 |
| 2019 | 50 | 45 |
| 2020 | 46 | 57 |
| 2021 | 46 | 88 |
| 2022 | 66 | 77 |
| 2023 | 91 | 89 |
| 2024 | 66 | 58 |
| 2025 | 56 | 64 |
| 2026 | 35 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic component with surface electrode layer6 Oct 2026US 12,755,904 B2TDK Corporation
- Thin film capacitor having a metal foil with roughened main surfaces, manufacturing method therefor, and electronic circuit board having the thin film capacitor6 Oct 2026US 12,755,907 B2TDK Corporation
- Film capacitor having bent lead wires and capacitor module29 Sep 2026US 12,749,625 B2LG Innotek Co., Ltd.
- Multilayer ceramic capacitor29 Sep 2026US 12,749,627 B2Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor comprising external electrodes with a long band portion8 Sep 2026US 12,731,733 B2Samsung Electro-Mechanics Co., Ltd.
- Mounting structure for electronic component17 Sep 2026US 2026/0279663 A1Murata Manufacturing Co., Ltd.
- Multilayer electronic component and board having the same mounted thereon17 Sep 2026US 2026/0279672 A1Samsung Electro-Mechanics Co., Ltd.
- Mounting structure for electronic component10 Sep 2026US 2026/0269123 A1Murata Manufacturing Co., Ltd.
- Multilayer ceramic capacitor3 Sep 2026US 2026/0260817 A1Murata Manufacturing Co., Ltd.
- Multilayer electronic component and mounting board thereof3 Sep 2026US 2026/0260818 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Surface mount multilayer capacitor138US 6,243,253 B1AVX Corporation · 2001
- Method for mounting parts on circuit boards74US 4,208,005 AHitachi, Ltd. · 1980
- Energy conditioning circuit assembly69US 6,606,011 B2X2Y Attenuators, LLC · 2003
- Ceramic electronic component64US 6,381,117 B1Murata Manufacturing Co., Ltd. · 2002