Mounting structure for electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsTakahito SHIMIZU, Masato KIMURA, Yuta KUROSU
Life of this patent
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Abstract
A mounting structure includes: a pair of lands disposed on a substrate so as to be apart from each other; a solder disposed on each of the lands; and an electronic component that has a component body and a pair of external electrodes, each of the external electrodes being connected to the land via the solder. Each of the external electrodes includes an extension part that covers a main surface and a side surface of the component body. When a direction orthogonal to the surface of the substrate is defined as the Z-direction, the dimension in the Z-direction of a gap defined between the land and the extension part is 1-100 μm, inclusive.
Claims16
A mounting structure for an electronic component comprising:
- a pair of lands provided on a substrate and spaced apart from each other;
- solder provided on each of the pair of lands;
- and
- an electronic component including
- a component main body including dielectric layers and internal electrode layers that are laminated, a pair of main surfaces opposed to each other in a lamination direction, a pair of lateral surfaces opposed to each other in a width direction orthogonal to the lamination direction, and a pair of end surfaces opposed to each other in a length direction orthogonal to the lamination direction and the width direction, and
- a pair of external electrodes each provided on a corresponding one of the pair of end surfaces, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder,
- wherein each of the pair of external electrodes includes an extension portion extending to at least one of a portion of each of the main surfaces and each of the lateral surfaces, and
- wherein, when a direction substantially orthogonal to a surface of the substrate is defined as a Z direction, a dimension in the Z direction of a gap defined between a corresponding one of the pair of lands and the extension portion is between 1 μm and 100 μm, inclusive.
A mounting structure for an electronic component comprising:
- a substrate having a pair of lands spaced apart by a separation portion;
- an electronic component having a component body and an external electrode, the external electrode having an extension portion overlapping one of the pair of lands;
- and
- a support member disposed on at least one of the substrate or the one of the pair of lands, the support member being configured to maintain a gap between the extension portion and the one of the pair of lands in a Z direction orthogonal to a surface of the substrate,
- wherein a thickness of a solder disposed in the gap is between 1 μm and 100 μm.
A method of manufacturing a mounting structure for an electronic component, the method comprising:
- providing an insulating film on a substrate having a pair of lands to define a support member;
- applying a solder material to a portion of the pair of lands not covered by the insulating film;
- placing an electronic component on the solder material such that a component body of the electronic component contacts the support member;
- and
- reflowing the solder material to form a solder connection having a thickness of 1 μm to 100 μm in a region between an extension portion of an external electrode of the electronic component and one of the pair of lands.
Dependencies are inferred from the claim text.