H01F 17/0013
With stacked layers
Official title: {with stacked layers}
H01F17/0013 (With stacked layers) appears on 2,936 US grants and 3,833 published applications in this corpus.
Search patents in H01F- Granted patents
- 2,936
- Published applications
- 3,833
- Assignees
- 500
- Inventors
- 4,143
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 8 | 0 |
| 1998 | 3 | 0 |
| 1999 | 11 | 0 |
| 2000 | 22 | 0 |
| 2001 | 20 | 15 |
| 2002 | 34 | 36 |
| 2003 | 46 | 55 |
| 2004 | 42 | 61 |
| 2005 | 45 | 54 |
| 2006 | 59 | 59 |
| 2007 | 46 | 67 |
| 2008 | 51 | 72 |
| 2009 | 46 | 74 |
| 2010 | 67 | 79 |
| 2011 | 64 | 67 |
| 2012 | 64 | 52 |
| 2013 | 61 | 133 |
| 2014 | 70 | 138 |
| 2015 | 86 | 155 |
| 2016 | 118 | 216 |
| 2017 | 114 | 218 |
| 2018 | 165 | 242 |
| 2019 | 184 | 323 |
| 2020 | 224 | 300 |
| 2021 | 208 | 244 |
| 2022 | 223 | 262 |
| 2023 | 262 | 266 |
| 2024 | 221 | 285 |
| 2025 | 228 | 209 |
| 2026 | 111 | 151 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Inductor coil and forming method thereof6 Oct 2026US 12,755,885 B2Semiconductor Manufacturing International (Shanghai) Corporation
- Laminated electronic component6 Oct 2026US 12,755,891 B2TDK Corporation
- Electronic component6 Oct 2026US 12,755,893 B2Murata Manufacturing Co., Ltd.
- Isolator29 Sep 2026US 12,749,787 B2Kabushiki Kaisha Toshiba
- LC filter, multiplexer, high frequency module, and communication device22 Sep 2026US 12,744,146 B2Murata Manufacturing Co., Ltd.
- Electronic component8 Oct 2026US 2026/0311928 A1TDK Corporation
- Filter, preparation method thereof, and electronic apparatus8 Oct 2026US 2026/0312561 A1Beijing BOE Sensor Technology Co., Ltd.
- Coil component1 Oct 2026US 2026/0302033 A1TDK Corporation
- Inductor component1 Oct 2026US 2026/0302034 A1TDK Corporation
- Inductor1 Oct 2026US 2026/0302054 A1TDK Corporation
Most cited
By later US patents
- Transmitter head and system for contactless energy transmission205US 7,492,247 B2Sew-Eurodrive GmbH & Co. KG · 2009
- Method for operation of multi-layer-multi-turn high efficiency inductors153US 8,710,948 B2NuCurrent, Inc. · 2014
- Method of manufacture of multi-layer wire structure152US 8,567,048 B2NuCurrent, Inc. · 2013
- Multi-layer-multi-turn structure for high efficiency inductors152US 8,680,960 B2NuCurrent, Inc. · 2014
- Method for operation of multi-layer-multi-turn high efficiency tunable inductors152US 8,698,591 B2NuCurrent, Inc. · 2014