Back to results
US 8,567,048 B2Granted
Method of manufacture of multi-layer wire structure
AssigneeNuCurrent, Inc.
InventorsVinit Singh, Christine A. Frysz, Matthew Geary, Eitan Babcock, Justin Derbas
Life of this patent
Estimating the term…
Abstract
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Claims20
A method of manufacturing a wire structure, the method comprising:
- forming a plurality of conductors, each conductor having a conductor length, a conductor width, a conductor thickness and a conductor skin depth within the conductor, wherein the conductor thickness is equal to or greater than a thickness of the skin depth;
- and
- forming a plurality of insulators, each insulator positioned between each of the plurality of conductors such that the wire structure is capable of propagating an electrical signal through the skin depth within the conductor.
Dependencies are inferred from the claim text.