H01F 2017/002
Details of via holes for interconnecting the layers
Official title: {Details of via holes for interconnecting the layers}
H01F2017/002 (Details of via holes for interconnecting the layers) appears on 378 US grants and 528 published applications in this corpus.
Search patents in H01F- Granted patents
- 378
- Published applications
- 528
- Assignees
- 134
- Inventors
- 951
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 4 |
| 2006 | 6 | 12 |
| 2007 | 7 | 21 |
| 2008 | 16 | 26 |
| 2009 | 13 | 20 |
| 2010 | 16 | 17 |
| 2011 | 24 | 21 |
| 2012 | 12 | 7 |
| 2013 | 13 | 11 |
| 2014 | 4 | 14 |
| 2015 | 7 | 21 |
| 2016 | 18 | 23 |
| 2017 | 12 | 25 |
| 2018 | 19 | 32 |
| 2019 | 23 | 45 |
| 2020 | 33 | 37 |
| 2021 | 22 | 24 |
| 2022 | 28 | 39 |
| 2023 | 36 | 39 |
| 2024 | 20 | 41 |
| 2025 | 29 | 28 |
| 2026 | 17 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inductor coil and forming method thereof6 Oct 2026US 12,755,885 B2Semiconductor Manufacturing International (Shanghai) Corporation
- Electronic component6 Oct 2026US 12,755,893 B2Murata Manufacturing Co., Ltd.
- Coil component18 Aug 2026US 12,712,118 B2Samsung Electro-Mechanics Co., Ltd.
- Coil component2 Jun 2026US 12,646,649 B2TDK Corporation
- Inductor19 May 2026US 12,633,444 B2Murata Manufacturing Co., Ltd.
- Coil component1 Oct 2026US 2026/0302033 A1TDK Corporation
- Inductor component17 Sep 2026US 2026/0279640 A1Murata Manufacturing Co., Ltd.
- Inductor member17 Sep 2026US 2026/0279657 A1Nitto Denko Corporation
- Inductor component10 Sep 2026US 2026/0269116 A1Murata Manufacturing Co., Ltd.
- Method and apparatus for matching inductors through a substrate carrier or core6 Aug 2026US 2026/0231329 A1Atlas Magnetics
Most cited
By later US patents
- Tunable embedded inductor devices133US 7,884,697 B2Industrial Technology Research Institute · 2011
- Precision inductive devices and methods72US 7,567,163 B2Pulse Engineering, Inc. · 2009
- Multi-layer transformer having electrical connection in a magnetic core67US 6,054,914 AMidcom, Inc. · 2000
- Compact inductor with stacked via magnetic cores for integrated circuits67US 7,262,680 B2Illinois Institute of Technology · 2007
- Circuit board embedded inductor45US 6,996,892 B1RF Micro Devices, Inc. · 2006