Circuit board embedded inductor
AssigneeRF Micro Devices, Inc.
InventorsDavid Dening, Steve Dorn, Milind Shah, Yang Rao, Michael Kay, Jon Jorgenson
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Abstract
A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.
Claims18
A method for manufacturing a circuit board having an embedded inductor comprising:
- providing a core structure comprising a dielectric core layer and a first metal layer on a top surface of the dielectric core layer;
- etching the first metal layer to form first inductor windings;
- depositing a material including a magnetic filler material over the first inductor windings;
- placing a first prepreg layer over the material including the magnetic filler material deposited over the first inductor windings;
- and
- attaching the first prepreg layer to the material including the magnetic filler material deposited over the first inductor windings.
The method 3 further comprising:
- providing a third metal layer on a top surface of the first prepreg layer;
- etching the third metal layer to form third inductor windings;
- depositing the material including the magnetic filler material over the third inductor windings;
- placing a third prepreg layer over the material including the magnetic filler material deposited over the third inductor windings;
- and
- attaching the third prepreg layer to the material including the magnetic filler material deposited over the third inductor windings.
The method 8 further comprising:
- providing a fourth metal layer on a bottom surface of the second prepreg layer;
- etching the fourth metal layer to form fourth inductor windings;
- depositing the material including the magnetic filler material over the fourth inductor windings;
- placing a fourth prepreg layer over the material including the magnetic filler material deposited over the fourth inductor windings;
- and
- attaching the fourth prepreg layer to the material including the magnetic filler material deposited over the fourth inductor windings.
Dependencies are inferred from the claim text.