Method and apparatus for matching inductors through a substrate carrier or core
AssigneeAtlas Magnetics
InventorsJohn Othniel McDonald, ERSED AKCASU OSMAN
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Abstract
Presented herein is a method of producing an inductor or inductor pair through a substrate, for example, a substrate core or carrier. The inductors have at least one winding which connects through the substrate. The inductors suffer the loss performance from the winding piercing the substrate, but are thus allowed to be arraigned, during manufacturing and subsequent use, according to a common centroid approach. This produces nearly identical inductors well suitable for matching or pairing.
Claims35
A method of producing a matched inductor comprising:
- taking a substrate;
- forming at least two through vias from a first surface of the substrate to a second surface of the substrate, which is the opposite surface of the first surface of the substrate;
- plating an inductor coil through the length of the vias to enable electrical connection through the through vias;
- and
- plating a first inductor on the first surface of the substrate and plating a second identical inductor on the second surface of the substrate so that the first inductor and the second inductor are electrically connected by the inductor coils traversing the through vias.
An inductor arraignment comprising:
- a substrate with at least one through vias from a first surface of the carrier to a second surface of the carrier which is the opposite surface of the first surface of the substrate;
- at least one upper inductor on the first surface of the substrate;
- at least one lower inductor on the second surface of the substrate;
- and
- At least one of the upper inductors is operably connected to the lower inductors by at least one coil of the upper inductor traveling through at least one via forming an inductor pair.
An inductor arraignment comprising:
- a substrate with at least one through via from a first surface of the substrate to a second surface of the substrate which is the opposite surface of the first surface of the substrate;
- a first portion of an inductor on the first surface of the substrate;
- a second portion of the inductor on the second surface of the substrate;
- and
- the first inductor portion is connected to the second inductor portion by at least one coil of the inductor traveling through at least one of the vias.
A method of producing inductors comprising:
- taking a substrate;
- forming at least one through via from a first surface of the substrate to a second surface of the substrate which is the opposite surface of the first surface of the substrate;
- plating an inductor coil through the length of the vias to enable electrical connection through the through vias;
- and
- plating a first portion of an inductor on the first surface of the substrate and plating a second portion of the inductor on the second surface of the substrate so that the first portion of the inductor and the second portion of the inductor are electrically connected by the inductor coils traversing the through vias.
Dependencies are inferred from the claim text.