Electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsRyuichiro Tominaga, Keisuke Kunimori, Yuuki Kawakami, Yoshimasa Yoshioka
Life of this patent
Estimating the term…
Abstract
An electronic component capable of improving connection reliability between a via conductor and a circuit pattern. An electronic component includes a circuit pattern; an insulating resin layer covering the circuit pattern; a via conductor provided inside the insulating resin layer and connected to the circuit pattern; and a wiring member connected to the circuit pattern via the via conductor. The via conductor and the wiring member are integrally formed, and in the via conductor, a diameter of an end portion on a side close to the circuit pattern is larger than a diameter of an end portion on a side close to the wiring member.
Claims6
An electronic component comprising:
- a circuit pattern;
- an insulating resin layer covering the circuit pattern;
- a via conductor inside the insulating resin layer and connected to the circuit pattern;
- and
- a wiring member connected to the circuit pattern via the via conductor,
- wherein
- the via conductor and the wiring member are integrally configured, and
- a diameter D1 of an end portion of the via conductor which is close to the circuit pattern is larger than a diameter D2 of another end portion of the via conductor which is close to the wiring member, a ratio T/D1 of a length T which is a distance between the end portion and the another end portion of the via conductor to the diameter D1 is from 0.1 to 0.2, and a ratio D2/D1 is from 0.7 to 0.9.
Dependencies are inferred from the claim text.