Laminated electronic component

A laminated electronic component comprising:

• an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and side surfaces configured to extend to intersect the bottom surface;
• and
• a bottom surface electrode formed on the bottom surface of the element body,
• wherein the bottom surface electrode includes a first electrode layer and a second electrode layer, such that the first electrode layer is formed on an exterior surface of the element body,
• the first electrode layer is a resin electrode laminated to cover the second electrode layer entirely, and has a stretched portion configured to extend to the side surface,
• a width dimension of the stretched portion is smaller than a width dimension of the first electrode layer on the bottom surface,
• the element body comprises an overcoat layer as an outermost layer that defines the bottom surface,
• an edge portion of the second electrode layer is covered with the overcoat layer,
• the overcoat layer is interposed between the edge portion of the second electrode layer and the first electrode layer, and
• the first electrode layer is connected to a portion of the second electrode layer that is exposed at the bottom surface.