G11C 2229/766
Laser fuses
G11C2229/766 (Laser fuses) appears on 5 US grants and 7 published applications in this corpus.
Search patents in G11C- Granted patents
- 5
- Published applications
- 7
- Assignees
- 7
- Inventors
- 12
- Latest grant
- 30 Sep 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 1 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 2 |
| 2013 | 1 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
By publication year.
Recent patents
- Semiconductor storage device with wiring that conserves space30 Sep 2014US 8,848,416 B2Lapis Semiconductor Co., Ltd.
- Implementing vertical die stacking to distribute logical function over multiple dies in through-silicon-via stacked semiconductor device20 Aug 2013US 8,516,409 B2International Business Machines Corporation
- Redundancy circuit11 Aug 2009US 7,573,763 B2Hynix Semiconductor Inc.
- Memory circuit comprising redundant memory areas13 May 2008US 7,373,562 B2Infineon Technologies AG
- Semiconductor memory device with test circuit28 Aug 2007US 7,263,010 B2Kabushiki Kaisha Toshiba
- Semiconductor structure, method for forming semiconductor structure, and fuse array21 Jul 2022US 2022/0230959 A1Changxin Memory Technologies, Inc.
- Semiconductor storage device28 Jun 2012US 2012/0163105 A1Lapis Semiconductor Co., Ltd.
- Implementing vertical die stacking to distribute logical function over multiple dies in through-silicon-via stacked semiconductor device17 May 2012US 2012/0124532 A1International Business Machines Corporation
- Redundancy circuit11 Dec 2008US 2008/0304341 A1Hynix Semiconductor Inc.
- Semiconductor device with a plurality of different one time programmable elements31 Jul 2008US 2008/0180983 A1Qimonda AG
Most cited
By later US patents
- Implementing vertical die stacking to distribute logical function over multiple dies in through-silicon-via stacked semiconductor device41US 8,516,409 B2International Business Machines Corporation · 2013
- Memory circuit comprising redundant memory areas9US 7,373,562 B2Infineon Technologies AG · 2008
- Semiconductor memory device with test circuit7US 7,263,010 B2Kabushiki Kaisha Toshiba · 2007
- Redundancy circuit6US 7,573,763 B2Hynix Semiconductor Inc. · 2009