G06K 19/07747
At least one of the integrated circuit chips being mounted as a
Official title: {at least one of the integrated circuit chips being mounted as a module}
G06K19/07747 (At least one of the integrated circuit chips being mounted as a) appears on 296 US grants and 254 published applications in this corpus.
Search patents in G06K- Granted patents
- 296
- Published applications
- 254
- Assignees
- 146
- Inventors
- 494
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 9 | 0 |
| 2000 | 11 | 0 |
| 2001 | 11 | 4 |
| 2002 | 14 | 5 |
| 2003 | 7 | 3 |
| 2004 | 8 | 13 |
| 2005 | 3 | 8 |
| 2006 | 9 | 13 |
| 2007 | 3 | 4 |
| 2008 | 5 | 1 |
| 2009 | 5 | 3 |
| 2010 | 2 | 4 |
| 2011 | 1 | 7 |
| 2012 | 2 | 6 |
| 2013 | 6 | 4 |
| 2014 | 8 | 5 |
| 2015 | 5 | 18 |
| 2016 | 13 | 18 |
| 2017 | 10 | 12 |
| 2018 | 16 | 8 |
| 2019 | 17 | 13 |
| 2020 | 15 | 9 |
| 2021 | 8 | 15 |
| 2022 | 10 | 15 |
| 2023 | 7 | 19 |
| 2024 | 18 | 22 |
| 2025 | 19 | 14 |
| 2026 | 10 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- IC card29 Sep 2026US 12,748,939 B2TDK Corporation
- Dual interface electronic module with value-add component and manufacturing method thereof16 Jun 2026US 12,657,422 B2Linxens Holding
- Wireless communication device manufacturing system26 May 2026US 12,637,314 B2Murata Manufacturing Co., Ltd.
- Antenna device and IC card having the same19 May 2026US 12,632,690 B2TDK Corporation
- Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting21 Apr 2026US 12,608,578 B2CompoSecure, LLC
- Smart Card Provided with a Screen for Displaying a Dynamic Code and Method for Manufacturing Same10 Sep 2026US 2026/0268109 A1
- Contactless Module with Configurable Antenna Coil30 Jul 2026US 2026/0220414 A1Sealsq France
- Integrated Circuit (IC) Module, Multi-Interface IC Card, and Methods of Forming Same16 Jul 2026US 2026/0206626 A1Act Identity Technology Limited
- Circuit board and chip package comprising same2 Jul 2026US 2026/0190224 A1LG Innotek Co., Ltd.
- Light-Emitting Electronic Module for a Chip Card25 Jun 2026US 2026/0176526 A1
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Single chip transponder device415US 4,857,893 ABI Incorporated · 1989
- IC module and smart card320US 6,378,774 B1Toppan Printing Co., Ltd. · 2002
- Transponder device225US 4,724,427 AB. I. Incorporated · 1988
- Integrated circuit device and manufacturing method thereof225US 5,122,860 AMatsushita Electric Industrial Co., Ltd. · 1992