G06K 19/07745
Mounting details of integrated circuit chips
Official title: {Mounting details of integrated circuit chips}
G06K19/07745 (Mounting details of integrated circuit chips) appears on 949 US grants and 768 published applications in this corpus.
Search patents in G06K- Granted patents
- 949
- Published applications
- 768
- Assignees
- 377
- Inventors
- 1,385
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 7 | 0 |
| 1985 | 7 | 0 |
| 1986 | 6 | 0 |
| 1987 | 8 | 0 |
| 1988 | 15 | 0 |
| 1989 | 18 | 0 |
| 1990 | 16 | 0 |
| 1991 | 19 | 0 |
| 1992 | 7 | 0 |
| 1993 | 13 | 0 |
| 1994 | 7 | 0 |
| 1995 | 10 | 0 |
| 1996 | 18 | 0 |
| 1997 | 21 | 0 |
| 1998 | 20 | 0 |
| 1999 | 25 | 0 |
| 2000 | 22 | 0 |
| 2001 | 31 | 10 |
| 2002 | 23 | 23 |
| 2003 | 30 | 25 |
| 2004 | 17 | 44 |
| 2005 | 22 | 39 |
| 2006 | 34 | 54 |
| 2007 | 22 | 30 |
| 2008 | 22 | 29 |
| 2009 | 18 | 24 |
| 2010 | 24 | 27 |
| 2011 | 21 | 27 |
| 2012 | 29 | 24 |
| 2013 | 29 | 16 |
| 2014 | 25 | 27 |
| 2015 | 28 | 42 |
| 2016 | 33 | 35 |
| 2017 | 29 | 35 |
| 2018 | 42 | 24 |
| 2019 | 37 | 45 |
| 2020 | 39 | 24 |
| 2021 | 24 | 38 |
| 2022 | 29 | 24 |
| 2023 | 19 | 35 |
| 2024 | 30 | 32 |
| 2025 | 30 | 23 |
| 2026 | 17 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- IC card29 Sep 2026US 12,748,939 B2TDK Corporation
- RFID switch tag30 Jun 2026US 12,670,354 B2Neology, Inc.
- Dual interface electronic module with value-add component and manufacturing method thereof16 Jun 2026US 12,657,422 B2Linxens Holding
- Wireless communication device manufacturing system26 May 2026US 12,637,314 B2Murata Manufacturing Co., Ltd.
- Systems and methods for constructing programmable credential and security cards26 May 2026US 12,639,544 B2Block, Inc.
- Smart Card Provided with a Screen for Displaying a Dynamic Code and Method for Manufacturing Same10 Sep 2026US 2026/0268109 A1
- Contactless Module with Configurable Antenna Coil30 Jul 2026US 2026/0220414 A1Sealsq France
- Integrated Circuit (IC) Module, Multi-Interface IC Card, and Methods of Forming Same16 Jul 2026US 2026/0206626 A1Act Identity Technology Limited
- Circuit board and chip package comprising same2 Jul 2026US 2026/0190224 A1LG Innotek Co., Ltd.
- Light-Emitting Electronic Module for a Chip Card25 Jun 2026US 2026/0176526 A1
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Single chip transponder device415US 4,857,893 ABI Incorporated · 1989
- IC module and smart card320US 6,378,774 B1Toppan Printing Co., Ltd. · 2002
- Method of making smart cards315US 5,955,021 ACardXX, Inc. · 1999
- Method for making a financial transaction card with embedded electronic circuitry288US 6,902,116 B2Innovative Card Technologies, Inc. · 2005