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US 6,902,116 B2Granted
Method for making a financial transaction card with embedded electronic circuitry
AssigneeInnovative Card Technologies, Inc.
InventorAlan Finkelstein
Life of this patent
Estimating the term…
Abstract
Financial transaction and similar cards are fabricated with a split core adapted to received embedded electronic circuitry. The card core has two or more laminated layers. The cavity is milled into one or more of the layers to receive the electronic circuitry. The core layers are then laminated together, along with protective overlays. Alternative fabrication methods include co-extrusion and injection molding.
Claims10
A method of constructing a card with embedded electronic circuitry comprising:
- printing first card graphics on a first surface of a first core member;
- printing second card graphics on a first surface of a second core member;
- laminating a first overlay to the first surface of the first core member;
- laminating a second overlay to the first surface of the second core member;
- milling a cavity in a second surface of the first core member after the first overlay has been laminated to the first surface of the first core member;
- installing electronic components in the cavity;
- aligning the second surface of the first core member with a second surface of the second core member;
- laminating together the first and second core members.
5 more elements
Dependencies are inferred from the claim text.