Dual interface electronic module with value-add component and manufacturing method thereof
AssigneeLinxens Holding
InventorCarsten Nieland
Life of this patent
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AssigneeLinxens Holding
InventorCarsten Nieland
Estimating the term…
The present invention refers to a dual interface electronic module for a smart card and to the fabrication method thereof. The dual interface electronic module comprises a contact plate for external connection, which includes at least one antenna electrical connector, and a multilayered PCB including a value-add component, for instance a display. The contact plate and the multilayered PCB are connected together by means of a plurality of interconnects at an interconnection interface; the contact plate has a first area in correspondence of the interconnection interface and the multilayered PCB has a second area in correspondence of the interconnection interface. The first area is larger than the second area, so as to define an excess portion and at least one portion of the at least one antenna electrical connector is placed on the excess portion so as to be exposed for being electrically connected to a corresponding antenna of the smart card. The present invention also refers to the smart card comprising such a dual interface electronic module and to the fabrication method thereof.
A dual interface smart card comprising:
A method for fabricating a dual interface smart card, said method comprising the following steps:
Dependencies are inferred from the claim text.