Integrated circuit device and manufacturing method thereof

An integrated circuit card comprising an integrated circuit device packaged in a well which is formed in a first side of a plastic card and which has bottom corner parts, said integrated circuit device comprising thin metal plates arranged substantially in one and the same plane with predetermined spaces therebetween and each having a first surface and a second surface, said first surface constituting an external connecting terminal and providing a portion of an outermost boundary of said integrated circuit card at said first side of said plastic card without extending beyond a plane defined by said first side of said plastic card;

• an integrated circuit element bonded to at least one of said thin metal plates at said second surface by means of an adhesive and having input/output electrodes;
• electrical connection means for connecting said input/output electrodes to said second surface;
• and a sealing molding resin having a first side and second side, for covering said electrical connection means and said integrated circuit element on said first side, said sealing molding resin having corners on said second side each being rounded to provide a curved corner surface, said sealing molding resin having a shape to enable it to be closely fitted in said well in said plastic card, whereby said rounded corners prevent said plastic card from being damaged at said corner parts event said plastic card is bent or curved.