G06F 2115/12
Printed circuit boards [pcb] or multi-chip modules [mcm]
Official title: Printed circuit boards [PCB] or multi-chip modules [MCM]
G06F2115/12 (Printed circuit boards [pcb] or multi-chip modules [mcm]) appears on 276 US grants and 343 published applications in this corpus.
Search patents in G06F- Granted patents
- 276
- Published applications
- 343
- Assignees
- 170
- Inventors
- 848
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 3 |
| 2003 | 3 | 7 |
| 2004 | 4 | 2 |
| 2005 | 1 | 0 |
| 2006 | 4 | 1 |
| 2007 | 0 | 3 |
| 2008 | 1 | 3 |
| 2009 | 2 | 1 |
| 2010 | 0 | 4 |
| 2011 | 2 | 2 |
| 2012 | 5 | 4 |
| 2013 | 2 | 2 |
| 2014 | 4 | 7 |
| 2015 | 4 | 12 |
| 2016 | 9 | 12 |
| 2017 | 10 | 9 |
| 2018 | 11 | 10 |
| 2019 | 19 | 21 |
| 2020 | 34 | 31 |
| 2021 | 19 | 33 |
| 2022 | 33 | 45 |
| 2023 | 37 | 40 |
| 2024 | 30 | 40 |
| 2025 | 22 | 30 |
| 2026 | 16 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-chip module (MCM) with multi-port unified memory25 Aug 2026US 12,717,996 B1Eliyan Corporation
- Dimensional model of a multi-thickness object in a computer-aided design environment18 Aug 2026US 12,711,297 B2Siemens Industry Software Inc.
- Evaluation apparatus, evaluation method, and evaluation program26 May 2026US 12,639,485 B2Tokyo Electron Limited
- Automated terminal wiring modification12 May 2026US 12,628,305 B1PassiveLogic, Inc.
- Signal and power integrated analog analysis system and method for full chip system5 May 2026US 12,619,811 B2J.W.Microelectronics Technology Co., Ltd
- Methods, controllers, and machine-readable storage media for automated commissioning of equipment8 Oct 2026US 2026/0313820 A1PassiveLogic, Inc.
- Rigid-flex circuit board1 Oct 2026US 2026/0300604 A1Dassault Systemes
- Overlapped interconnect with enhanced design1 Oct 2026US 2026/0304601 A1Micron Technology, Inc.
- Reliability assessment of an electronic component carrier or a package comprising it using ai-supported finite elements analysis20 Aug 2026US 2026/0244825 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Systems and methods for printed circuit board netlist extraction from multimodal imagery13 Aug 2026US 2026/0237225 A1
Most cited
By later US patents
- Controller modules155US 11,229,138 B1PassiveLogic, Inc. · 2022
- Parts selection apparatus and parts selection system with CAD function134US 6,289,254 B1Canon Kabushiki Kaisha · 2001
- Hierarchical adaptive state machine for emulating and augmenting software121US 5,903,886 ASmartlynx, Inc. · 1999
- Method and apparatus for concurrent engineering and design synchronization of multiple tools72US 7,143,341 B1Cadence Design Systems, Inc. · 2006
- Parallel electronic design automation: distributed simultaneous editing41US 6,711,718 B22004