Back to results
US 12,717,996 B1Granted
Multi-chip module (MCM) with multi-port unified memory
AssigneeEliyan Corporation
InventorRamin Farjadrad
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeEliyan Corporation
InventorRamin Farjadrad
Estimating the term…
Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a package substrate and an interposer disposed on a portion of the package substrate. A first integrated circuit (IC) chip is disposed on the interposer. A first memory device is disposed on the interposer and includes a first port interface including an interposer-compliant mechanical interface for coupling to the first IC chip via a first set of traces formed in the interposer. A second port interface includes a non-interposer-compliant mechanical interface for coupling to an off-interposer device. Transactions between the first IC chip and the off-interposer device pass through the first port interface and the second port interface of the first memory device.
A chiplet-based system-in-package (SiP) to mount to a base substrate, the chiplet-based SiP comprising:
A logic base die for inclusion in a chiplet-based system-in-package (SiP), the logic base die comprising:
A method of operation in a chiplet-based system-in-package (SiP), the chiplet-based SiP comprising a package substrate, a routing layer coupled to a first portion of the package substrate, the routing layer comprising contacts, an integrated circuit (IC) chiplet comprising an interface coupled to the routing layer via a portion of the interface that defines an interface beachfront, the IC chiplet to deliver data of a first bandwidth via the interface beachfront, and a first logic base die comprising a first port interface to couple to the interface beachfront of the IC chiplet, the method comprising:
Dependencies are inferred from the claim text.