Dimensional model of a multi-thickness object in a computer-aided design environment

A data processing system comprising:

• a processing unit;
• and
• a memory unit communicatively coupled to the processing unit, wherein the memory unit comprises a computer-aided design (CAD) module, the CAD module being configured to:
• generate a first feature of a three-dimensional model of a multi-thickness printed circuit board (PCB) in a formed state with reference to a first virtual datum plane based on a first thickness value of the first feature;
• receive a request to generate a second feature of the three-dimensional model from a user via a graphical user interface, wherein the request comprises a second thickness value of the second feature and a location of the second feature;
• create a second virtual datum plane that is aligned with the first virtual datum plane;
• dynamically compute an offset value for the second feature in the three-dimensional model with reference to the second virtual datum plane based on the second thickness value, wherein the offset value indicates a distance by which the second feature is to be offset from the second virtual datum plane;
• generate the second feature of the three-dimensional model in the formed state with reference to the second virtual datum plane based on the second thickness value, the location of the second feature, and the offset value, wherein the generated second feature is offset from the second virtual datum plane by the offset value;
• display the three-dimensional model of the multi-thickness PCB in the formed state comprising the first feature and the second feature on the graphical user interface;
• and
• store the three-dimensional model of the multi-thickness PCB for manufacturing the multi-thickness PCB having the first feature and the second feature.

A non-transitory computer-readable storage medium that stores machine-readable instructions executable by a data processing system to generate a three-dimensional model, the machine-readable instructions comprising:

• generating a first feature of a three-dimensional model of a multi-thickness printed circuit board (PCB) in a formed state with reference to a first virtual datum plane based on a first thickness value of the first feature;
• receiving a request to generate a second feature of the three-dimensional model from a user via a graphical user interface, wherein the request comprises a second thickness value of the second feature and location of the second feature;
• creating a second virtual datum plane that is aligned with the first virtual datum plane;
• dynamically computing an offset value for the second feature in the three-dimensional model with reference to the second virtual datum plane based on the second thickness value, wherein the offset value indicates a distance by which the second feature is to be offset from the second virtual datum plane;
• generating the second feature of the three-dimensional model in the formed state with reference to the second virtual datum plane based on the second thickness value, the location of the second feature and the offset value, wherein the generated second feature is offset from the second virtual datum plane by the offset value;
• displaying the three-dimensional model of the multi-thickness PCB in the formed state comprising the first feature and the second feature on the graphical user interface;
• and
• storing the three-dimensional model of the multi-thickness PCB for manufacturing the multi-thickness PCB having the first feature and the second feature.