G05B 2219/45232
Cmp chemical mechanical polishing of wafer
Official title: CMP chemical mechanical polishing of wafer
G05B2219/45232 (Cmp chemical mechanical polishing of wafer) appears on 66 US grants and 48 published applications in this corpus.
Search patents in G05B- Granted patents
- 66
- Published applications
- 48
- Assignees
- 27
- Inventors
- 117
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 5 |
| 2002 | 5 | 6 |
| 2003 | 1 | 2 |
| 2004 | 2 | 4 |
| 2005 | 1 | 2 |
| 2006 | 5 | 5 |
| 2007 | 2 | 1 |
| 2008 | 2 | 0 |
| 2009 | 2 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 3 |
| 2012 | 1 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 3 | 1 |
| 2016 | 0 | 3 |
| 2017 | 1 | 0 |
| 2018 | 3 | 3 |
| 2019 | 3 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 2 |
| 2024 | 0 | 3 |
| 2025 | 1 | 2 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Information processing device, substrate processing device, and information processing method23 Jun 2026US 12,663,780 B2Ebara Corporation
- Processing condition setting apparatus, processing condition setting method, and wafer production system16 Jun 2026US 12,654,277 B2Sumco Corporation
- Semiconductor processing tool and methods of operation6 Jan 2026US 12,519,020 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for generating post-polishing topography for enhanced wafer manufacturing12 Aug 2025US 12,386,340 B2GlobalWafers Co., Ltd.
- CMP polishing system and associated pilot management system26 Jul 2022US 11,397,425 B2United Semiconductor (Xiamen) Co., Ltd.
- Semiconductor processing tool and methods of operation30 Apr 2026US 2026/0123360 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for generating post-polishing topography for enhanced wafer manufacturing6 Nov 2025US 2025/0341824 A1GlobalWafers Co., Ltd.
- Systematic delayering of chips28 Aug 2025US 2025/0273470 A1International Business Machines Corporation
- Semiconductor process device, control method and apparatus for moving parts thereof10 Oct 2024US 2024/0338008 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Information processing device, substrate processing device, and information processing method12 Sep 2024US 2024/0302817 A1Ebara Corporation
Most cited
By later US patents
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- Wafer polishing method and apparatus209US 5,329,732 ASpeedfam Corporation · 1994
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998