US 2026/0123360 A1 · SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

Abstract

Some implementations described herein provide techniques and apparatuses for polishing a perimeter region of a semiconductor substrate so that a roll-off profile at or near the perimeter region of the semiconductor substrate satisfies a threshold. The described implementations include depositing a first layer of a first oxide material across the semiconductor substrate followed by depositing a second layer of a second oxide material over the first layer of the first oxide material and around a perimeter region of the semiconductor substrate. The described implementations further include polishing the second layer of the second oxide material over the perimeter region using a chemical mechanical planarization tool including one or more ring-shaped polishing pads oriented vertically over the perimeter region.

Claims20

Dependent claims

A chemical mechanical planarization tool comprising:

a platen configured to rotate a semiconductor substrate about a vertical axis at a first rotational velocity;
a ring-shaped polishing pad configured to rotate about a horizontal axis that is approximately orthogonal to the vertical axis at a second rotational velocity;
an actuator component mechanically-coupled to the ring-shaped polishing pad;
and
a controller configured to:
receive a first signal including first information corresponding to a status of a polishing operation performed at or near a perimeter region of the semiconductor substrate;
determine, based on the first information, to adjust a radial location of the ring-shaped polishing pad relative to the vertical axis;
and
transmit, to the actuator component, a second signal including second information to cause the actuator component to adjust the radial location.

6 more elements

A method, comprising:

transmitting a first signal including first information to cause a platen motor component to rotate a platen holding a semiconductor substrate about a first axis at a first rotational velocity;
transmitting a second signal including second information to cause a polishing pad motor component to rotate a ring-shaped polishing pad about a second axis that is approximately orthogonal to the first axis at a second rotational velocity;
receiving a third signal including third information corresponding to a status of a polishing operation performed on the semiconductor substrate;
transmitting a fourth signal including fourth information to cause the polishing pad motor component to adjust the second rotational velocity;
receiving a fifth signal including fifth information corresponding to a compressive force between the ring-shaped polishing pad and a surface of the semiconductor substrate;
and
transmitting a sixth signal including sixth information to cause an actuator component to adjust the compressive force.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor processing tool and methods of operation

Life of this patent

Semiconductor processing tool and methods of operation

Life of this patent

Abstract

Claims20