Semiconductor processing tool and methods of operation

A method, comprising:

• transmitting, by a controller, a first signal including first information to cause a platen motor component to rotate a platen holding a semiconductor substrate about a first axis at a first rotational velocity;
• transmitting, by the controller, a second signal including second information to cause a polishing pad motor component to rotate a ring-shaped polishing pad about a second axis that is approximately orthogonal to the first axis at a second rotational velocity;
• receiving, by the controller and from a camera component, a third signal including third information corresponding to a status of a polishing operation performed at or near a perimeter region of the semiconductor substrate;
• determining, by the controller based on the third information, to adjust the first rotational velocity and the second rotational velocity;
• transmitting, by the controller, a fourth signal including fourth information to cause the polishing pad motor component to adjust the second rotational velocity;
• and
• transmitting, by the controller, a fifth signal including fifth information to cause the platen motor component to adjust the first rotational velocity.

A method, comprising:

• forming a first layer of a first material over a semiconductor substrate;
• forming a second layer of a second material on a portion of the first layer of the first material over a perimeter region of the semiconductor substrate;
• rotating the semiconductor substrate about a vertical axis passing through a center of the semiconductor substrate;
• and
• removing a portion of the second layer of the second material using a combination of one or more ring-shaped polishing pads rotating about one or more axes that are approximately orthogonal to the vertical axis.